A security wrap ( 20 ) for protecting an electronic component ( 16 ) includes a substrate ( 26 ) having a first side and a second side opposite to each other. A conductive path ( 22 ) is disposed over the first side of the substrate ( 26 ) and has first and second ends coupled to the electronic component ( 16 ), and a pattern selected from a plurality of predetermined patterns. A layer of adhesive ( 28 ) is over the first side of the substrate ( 26 ) and bonds the first side of the substrate ( 26 ) to the electronic component ( 16 ) with the conductive path ( 22 ) sandwiched there between.
1. A security wrap for protecting an electronic component, comprising:
a substrate having a first side and a second side opposite to each other;
a conductive path disposed over the first side of said substrate and having first and second ends coupled to the electronic component, and a pattern selected from a plurality of predetermined patterns;
screen terminals printed on the substrate;
a layer of adhesive over the first side of said substrate and bonding the first side of said substrate to the electronic component with said conductive path sandwiched there between; and
holes formed in the layer of adhesive, the holes being disposed to align with the screen terminals.
2. The security wrap of claim 1 , wherein the pattern of said conductive path is selected from the plurality of predetermined patterns randomly.
3. The security wrap of claim 1 , further comprising a second conductive path disposed over said substrate and overlaying the conductive path and having first and second ends coupled to the electronic component, and a pattern different from the pattern of he conductive path and selected from the plurality of predetermined patterns.
4. The security wrap of claim 3 , wherein the second conductive path is disposed over the second side of said substrate.
5. The security wrap of claim 3 , further comprising a dielectric layer disposed over said conductive path, wherein said second conductive path is disposed over said dielectric layer.
6. The security wrap of claim 5 , wherein:
said dielectric layer includes a conductive via formed therein; and
the second end of said conductive path is coupled to the first end of said second conductive path via the conductive via in said dielectric layer.
7. The security wrap of claim 6 , wherein:
the electronic component includes an alarm circuit having first and second terminals; and
said conductive path and said second conductive path are connected in series between the first and second terminals of the alarm circuit of the electronic component.
8. The security wrap of claim 1 , further comprising an intermittent adhesion modification pattern disposed between the first side of said substrate and said conductive path.
9. The security wrap of claim 8 , wherein said intermittent adhesion modification pattern has a bonding strength between the first side of said substrate and said conductive path less than a bond strength between said conductive path and the electronic component.
10. A security wrap for protecting an electronic component, comprising;
a substrate having a first side and a second side opposite to each other;
a conductive path disposed over the first side of said substrate and having first and second ends coupled to the electronic component, and a pattern selected from a plurality of predetermined patterns;
a layer of adhesive over the first side of said substrate and bonding the first side of said substrate to the electronic component with said conductive path sandwiched there between,
wherein the pattern of said conductive path is selected from the plurality of predetermined patterns in accordance with an algorithm to reduce the probability of pattern repetition.
11. A security wrap for protecting a device having an alarm circuit, comprising:
a first substrate having a first side and a second side opposite to each other;
a first conductive track disposed over the first side of said first substrate, coupled to the alarm circuit of the device, and having a first pattern selected from a plurality of predetermined patterns;
a second conductive track disposed over said first substrate, coupled to the alarm circuit of the device, and having a second pattern different from the first pattern and selected from the plurality of predetermined patterns;
screen terminals printed on the first substrate;
a first layer of adhesive over the first side of said first substrate and bonding the first side of said first substrate to the device with said first conductive sandwiched there between; and
holes formed in the first layer of adhesive, the holes being disposed to align with the screen terminals.
12. The security wrap of claim 11 , wherein the second conductive track is disposed over the second side of said first substrate.
13. The security wrap of claim 11 , further comprising a dielectric layer disposed over said first conductive track, wherein said second conductive track is disposed over said dielectric layer.
14. The security wrap of claim 11 , wherein the first conductive track and the second conductive track are connected in series.
15. The security wrap of claim 11 wherein the first conductive track and the second conductive track have predetermined resistances and are connected in parallel.
16. The security wrap of claim 11 , further comprising:
a second substrate overlaying said first substrate;
a third conductive track disposed over said second substrate, coupled to the alarm circuit of the device, and having a third pattern selected from the plurality of predetermined patterns;
a fourth conductive track disposed over said second substrate, coupled to the alarm circuit of the device, and having a fourth pattern different from the third pattern and selected from the plurality of predetermined patterns; and
a second layer of adhesive over said second substrate and bonding said second substrate to the second side of said first substrate.
17. The security wrap of claim 16 , further comprising a dielectric layer between said third conductive track and the fourth conductive track and having a conductive via form therein, wherein said third conductive track and said fourth conductive track are connected in series via the conductive via in said dielectric layer.
18. The security wrap of claim 16 , wherein the third and fourth conductive tracks are disposed over the opposite sides of the second substrate.
19. The security wrap of claim 16 , further comprising:
a third substrate overlaying said first substrate and said second substrate;
a fifth conductive track disposed over said third substrate, coupled to the alarm circuit of the device, and having a fifth pattern selected from the plurality of predetermined patterns;
a sixth conductive track disposed over said third substrate, coupled to the alarm circuit of the device, and having a sixth pattern different from the fifth pattern and selected from the plurality of predetermined patterns; and
a third layer of adhesive over of said third substrate and bonding said third substrate to said second substrate.
20. A security wrap for protecting a device having an alarm circuit, comprising:
a first substrate having a first side and a second side opposite to each other;
a first conductive track disposed over the first side of said first substrate, coupled to the alarm circuit of the device, and having a first pattern selected from a plurality of predetermined patterns;
a second conductive track disposed over said first substrate, coupled to the alarm circuit of the device, and having a second pattern different from the first pattern and selected from the plurality of predetermined patterns; and
a first layer of adhesive over the first side of said first substrate and bonding the first side of said first substrate to the device with said first conductive sandwiched there between,
wherein the first pattern of said first conductive track and the second pattern of said second conductive track are selected from the plurality of predetermined patterns in accordance with an algorithm to reduce the probability of pattern repetition in a security wrap production process.