Semiconductor integrated circuit device and a method of manufacturing the same
Semiconductor device including a memory cell featuring a first gate insulating film over a semiconductor substrate, a control gate electrode over the first gate insulating film, a second gate insulating film over the substrate and a side wall of the control gate electrode, a memory gate electrode over the second gate insulating film arranged adjacent with the control gate electrode through the second gate insulating film, first and second semiconductor regions in the substrate positioned on a control gate electrode side and a memory gate side, respectively, the second gate insulating film featuring a first film over the substrate, a charge storage film over the first film and a third film over the second film, the first film having a first portion between the substrate and memory gate electrode and a thickness greater than that of a second portion between the control gate electrode and the memory gate electrode.
1. A semiconductor device comprising a memory cell,
the memory cell including:
a first gate insulating film formed over a semiconductor substrate,
a control gate electrode formed over the first gate insulating film,
a second gate insulating film formed over the semiconductor substrate and over a side wall of the control gate electrode,
a memory gate electrode formed over the second gate insulating film and arranged adjacent with the control gate electrode through the second gate insulating film,
a first semiconductor region formed in the semiconductor substrate and positioned on a control gate electrode side, and
a second semiconductor region formed in the semiconductor substrate and positioned on a memory gate electrode side,
wherein the second gate insulating film has a first insulating film formed over the semiconductor substrate, second insulating film formed over the first insulating film and a third insulating film formed over the second insulating film,
wherein the second insulating film includes a charge storage film,
wherein the first insulating film has a first portion and a second portion, the first portion formed between the semiconductor substrate and the memory gate electrode and the second portion formed between the control gate electrode and the memory gate electrode,
wherein a thickness of the second portion is greater than a thickness of the first portion.
2. A semiconductor device according to the claim 1 ,
wherein the first and third insulating films include a silicon oxide film, respectively, and
wherein the second insulating film includes a silicon nitride film.
3. A semiconductor device according to the claim 1 ,
wherein the memory gate electrode is in a form of a side wall.
4. A semiconductor device comprising a memory cell,
the memory cell including:
a first insulating film formed over a semiconductor substrate,
a first gate electrode formed over the first insulating film,
a second insulating film formed over the semiconductor substrate,
a second gate electrode formed over the second insulating film and arranged adjacent with the first gate electrode,
a third insulating film formed between the first gate electrode and the second gate electrode,
a first semiconductor region formed in the semiconductor substrate and positioned on a first gate electrode side, and
a second semiconductor region formed in the semiconductor substrate and positioned on a second gate electrode side,
wherein the second insulating film includes a charge storage film,
wherein a thickness of the third insulating film is greater than a thickness of the second insulating film.
5. A semiconductor device according to the claim 4 ,
wherein the second insulating film includes a fourth insulating film formed over the semiconductor substrate, a fifth insulating film formed over the fourth insulating film and a sixth insulating film formed over the fifth insulating film,
wherein the third insulating film includes a seventh insulating film formed over a side wall of the first gate electrode, the fifth insulating film formed over the seventh insulating film and the sixth insulating film formed over the fifth insulating film, and
wherein a thickness of the seventh insulating film is greater than a thickness of the fourth insulating film.
6. A semiconductor device according to the claim 5 ,
wherein the fourth, sixth and seventh insulating film includes a silicon oxide film, and
wherein the fifth insulating film includes a silicon nitride film.
7. A semiconductor device according to the claim 4 ,
wherein the second gate electrode is in a form of a side wall.