Semiconductor memory device and system having the same

1. A semiconductor memory device, comprising:

a first select transistor;

a first dummy transistor coupled between a bit line and the first select transistor;

a second select transistor;

a second dummy transistor coupled between a common source line and the second select transistor; and

main cell transistors coupled between the first and second select transistors,

wherein each of the first and second dummy transistors, the first and second select transistors and the main cell transistors includes a portion of a vertical channel layer, a tunnel insulating layer surrounding the vertical channel insulating layer surrounding the charge storage layer and a conductive layer surrounding the blocking insulating layer, the vertical channel layer being extended in a direction intersecting a substrate, and

wherein an impurity concentration of a first portion of the vertical channel layer, included in each of the first and second dummy transistors, is different from an impurity concentration of a second portion of the vertical channel layer, included in each of the first and second select transistors and each of the main cell transistors.

2. The semiconductor memory device of claim 1 , further comprising:

a first dummy cell transistor coupled between the first select transistor and the main cell transistors; and

a second dummy cell transistor coupled between the second select transistor and the main cell transistors.

3. The semiconductor memory device of claim 1 , wherein the main cell transistors are coupled between the first and second select transistors and are vertically coupled to a substrate.

4. The semiconductor memory device of claim 1 , wherein the main cell transistors are divided into a first main cell transistor group and a second main cell transistor group, and

the semiconductor memory device further includes a pipe transistor coupled between the first and second main cell transistor groups.

5. The semiconductor memory device of claim 4 , wherein the main cell transistors of the first main cell transistor group, coupled between the first select transistor and the pipe transistor, are vertically coupled to a substrate, and

the main cell transistors of the second main cell transistor group, coupled between the second select transistor and the pipe transistor, are vertically coupled to the substrate.

6. The semiconductor memory device of claim 4 , further comprising:

a third dummy cell transistor coupled between the pipe transistor and the first main cell transistor group; and

a fourth dummy cell transistor coupled between the pipe transistor and the second main cell transistor group.

7. The semiconductor memory device of claim 1 , wherein the first portion of the vertical channel layer of each of the first and second dummy transistors includes a silicon layer doped with impurities to control a threshold voltage.

8. include allowable subject matter since the prior art made of record and considered pertinent to the applicant's disclosure, taken individually or in combination, does not teach or suggest the claimed invention having:

a plurality of memory strings coupled between a plurality of bit lines and a common source line, wherein each of the plurality of memory strings includes a first dummy transistor coupled to the bit line, main cell transistors, a first select transistor coupled between the first dummy transistor and the main cell transistors, and a second dummy transistor coupled to the common source line, and a second select transistor coupled between the second dummy transistor and the main cell transistors; and

a peripheral circuit configured to perform a program operation of the first and second select transistors and the main cell transistors and a read operation and an erase operation of the main cell transistors,

wherein each of the first and second dummy transistors, the first and second select transistors and the main cell transistors includes a portion of a vertical channel layer, a tunnel Insulating layer surrounding the vertical channel layer, a charge storage layer surrounding the tunnel insulating layer, a blocking Insulating layer surrounding the charge storage layer and a conductive layer surrounding the blocking insulating layer˜ the vertical channel layer being extended in a direction intersecting a substrate,

wherein an impurity concentration of a first portion of the vertical channel layer, included in each of the first and second dummy transistors, is different from an impurity concentration of a second portion of the vertical channel layer, included in each of the first and second select transistors and each of the main cell transistors, and

wherein the peripheral circuit is configured to turn on the first dummy transistor and turn off the second dummy transistor during the program operation.

9. The semiconductor memory device of claim 8 , wherein threshold voltages of the first and second dummy transistors are determined by impurities implanted into the first portion of the vertical channel layer, included in each of the first and second dummy transistors, and

threshold voltages of the first and second select transistors and the main cell transistors are determined by the program operations performed by the peripheral circuit.

10. The semiconductor memory device of claim 8 , wherein the peripheral circuit performs the program operation of the first and second select transistors in order to increase threshold voltages of the first and second select transistors to a predetermined level, irrespective of data.

11. The semiconductor memory device of claim 8 , wherein the peripheral circuit is configured to apply a program inhibit voltage to the bit line and the first dummy transistor in order to inhibit programming of the first select transistor having a threshold voltage greater than a target level during the program operation of the first select transistors.

12. The semiconductor memory device of claim 8 , wherein the peripheral circuit performs the program operation of the first and second select transistors at the same time.

13. The semiconductor memory device of claim 8 , wherein the peripheral circuit is configured to apply a read pass voltage to the first and second dummy transistors during the read operations of the main cell transistors.

14. The semiconductor memory device of claim 8 , wherein the peripheral circuit is configured to set gates of the first and second dummy transistors to a floating state during the erase operation of the main cell transistors.

15. The semiconductor memory device of claim 8 , further comprising:

a first dummy cell transistor coupled between the first select transistor and the main cell transistors; and

a second dummy cell transistor coupled between the second select transistor and the main cell transistors.

16. include allowable subject matter since the prior art made of record and considered pertinent to the applicant's disclosure, taken individually or in combination, does not teach or suggest the claimed invention having:

a first dummy transistor formed where a first dummy gate line surrounds a vertical channel layer and coupled to a first select transistor, the vertical channel layer being extended in a direction intersecting a substrate and;

a second dummy transistor formed where a second dummy gate line surrounds the vertical channel layer and coupled to a second select transistor; and

main cell transistors coupled between the first and second select transistors,

wherein an impurity concentration of a first portion of the vertical channel layer, corresponding to each of the first and second dummy transistors, is different from an impurity concentration of a second portion of the vertical channel layer, corresponding to each of the first and second select transistors.

17. The semiconductor memory device of claim 16 , wherein the first dummy transistor is coupled between the first select transistor and a bit line, and

the second dummy transistor is coupled between the second select transistor and a common source line.