Wiring board and manufacturing method of wiring board
There is provided a wiring board including a first stiffener, one face of which is bonded to a circuit board, a second stiffener having a disposition hole in which an electronic component is disposed, and a laminate that is formed by laminating a plurality of insulating layers and a plurality of wiring layers between the other face of the first stiffener and one face of the second stiffener, and includes a terminal connection part that is connected to the wiring layers, positioned in the disposition hole, and connected to a terminal part of the electronic component.
1. A wiring board comprising:
a first stiffener, one face of which is bonded to a circuit board;
a second stiffener having a disposition hole in which an electronic component is disposed; and
a laminate that is formed by laminating a plurality of insulating layers and a plurality of wiring layers between the other face of the first stiffener and one face of the second stiffener, and includes a terminal connection part that is connected to the wiring layers, positioned in the disposition hole, and connected to a terminal part of the electronic component.
2. The wiring board according to claim 1 , wherein a through hole for connection to the circuit board is formed in the first stiffener.
3. A manufacturing method of a wiring board, comprising:
bonding two first stiffeners between which a bonding material is sandwiched;
forming laminates by laminating a plurality of insulating layers and a plurality of wiring layers on respective faces of the respective first stiffeners opposite to bonded faces, the laminates each having a terminal connection part connected to the wiring layers;
forming second stiffeners each having a disposition hole in which an electronic component connected to the terminal connection part is disposed on respective faces of the respective laminates opposite to the first stiffeners; and
separating the two first stiffeners from each other and removing the bonding material.
4. The manufacturing method of a wiring board according to claim 3 , wherein a through hole for connection to a circuit board is formed in each of the first stiffeners.
5. The manufacturing method of a wiring board according to claim 3 , wherein a thermoplastic film is used as the bonding material.