IP Library › Patent Application 13959270
Patent Application
App. No. 13/959,270

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

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Quick Facts
Patent No.
US None
App. No.
13/959,270
Abstract

A substrate bonding apparatus includes a vacuum chamber having a bonding space where a first substrate and a second substrates are bonded together, a first pump for sucking air of the bonding space at a first intensity, a second pump for sucking the air of the bonding space at a second intensity greater than the first intensity, a nitrogen supply for supplying nitrogen to the bonding space, a sensor for sensing the pressure of the bonding space; and a controller for controlling the first pump, the second pump, and the nitrogen supply.

Claims (16)

1 - 5 . (canceled)

6 . A substrate bonding method, comprising:

loading a first substrate and a second substrate constituting an organic light emitting diode display device onto a bonding space of a vacuum chamber;

sensing a pressure of the bonding space;

controlling the pressure of the bonding space so as to be any one of a first pressure, a second pressure less than the first pressure, and a third pressure less than the second pressure in accordance with a shape of a space formed between the first substrate and the second substrate by bonding the first and second substrates together; and

bonding the first substrate and the second substrate together.

7 . The method of claim 6 , wherein:

at least one of the first and second substrates is provided with a groove at a portion facing the other substrate, and the space formed between the first and second substrates by bonding the first and second substrates together has projected and recessed portions; and

the pressure of the bonding space is controlled so as to be the first pressure in a range of 1 MPa to 1000 Pa.

8 . The method of claim 6 , wherein:

surfaces of the first and second substrates are flat, and the space formed between the first and second substrates by bonding the first and second substrates together is a rectangular; and

the pressure of the bonding space is controlled so as to be the second pressure in a range of 1000 Pa to 10 Pa.

9 . The method of claim 6 , wherein:

surfaces of the first and second substrates are flat, and a filling material contacting the first substrate and the second substrate is provided in the space formed between the first and second substrates by bonding the first and second substrates together; and

the pressure of the bonding space is controlled so as to be the third pressure in a range of 10 Pa to 1 Pa.

10 - 13 . (canceled)