IP Library Granted Patent US 8,711,054
Granted Patent B2
US 8,711,054 · App. 13/961,906 · Granted Apr 29, 2014

Electronic device with embedded antenna

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Quick Facts
Patent No.
US 8,711,054
App. No.
13/961,906
Granted
Apr 29, 2014
Kind
B2
Abstract

An electronic device with an embedded three-dimensional antenna is disclosed. The electronic device includes a printed circuit board (PCB) and an embedded three-dimensional antenna. The embedded three-dimensional antenna includes a radiation element and a connection element. The connection element includes a first connection part and a second connection part. The first and second connection parts are coupled to the PCB, and utilized for transferring signals of the embedded three-dimensional antenna to the PCB. The first and second connection parts further clamp the PCB to attach the embedded three-dimensional antenna on the PCB.

Claims (13)

1. An electronic device with an embedded three-dimensional antenna, the electronic device comprising:

a printed circuit board (PCB); and

an embedded three-dimensional antenna comprising:

a radiation element; and

a connection element comprising a first connection part and a second connection part, the first and second connection parts, respectively coupled to the PCB, for transferring signals of the embedded three-dimensional antenna to the PCB;

wherein the first and second connection parts clamp the PCB such that the embedded three-dimensional antenna is attached on the PCB; wherein the connection element is formed at one end of the radiation element; and wherein the first and second connection parts respectively comprise a notch, for attaching a distance from the radiation element to the lateral of the PCB.

2. The electronic device of claim 1 , wherein the embedded three-dimensional antenna further comprises a clamping element, formed at another end of the radiation element as an auxiliary of the connection element.

3. The electronic device of claim 1 , wherein the first and second connection parts are a feeding terminal and a grounding terminal of the embedded three-dimensional antenna, respectively, and are coupled to metal contacts of the PCB.

4. The electronic device of claim 1 , wherein tail ends of the first and second connection parts have an outward warped mechanism, respectively.

5. The electronic device of claim 1 , wherein the radiation element is a bended metal sheet disposed on a lateral of the PCB.

6. The electronic device of claim 1 , wherein the radiation element is a bended metal sheet disposed on one side of the PCB.

7. The electronic device of claim 1 , wherein the embedded three-dimensional antenna is formed by a single metal sheet.

8. The electronic device of claim 1 , wherein the embedded three-dimensional antenna is a planar inverted-F antenna (PIFA).

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2021
From: MEDIATEK INC.
To: XUESHAN TECHNOLOGIES INC.
Reel/Frame 055486/0870 →
MERGER (RESUBMISSION OF THE MISSING MERGER DOCUMENTS FOR RESPONSE TO DOC ID:502887510) EFFECTIVE DATE:04/01/2014. WE ATTACHED THE MERGER DOCUMENTS ON JULY 11,2014. PLEASE REVIEW THE FILES AND REVISE THE DATE OF RECORDATION AS JULY 11, 2014. Recorded Jul 11, 2014
From: RALINK TECHNOLOGY CORP.
To: MEDIATEK INC.
Reel/Frame 033471/0181 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2013
From: WU, MIN-CHUNG; LO, SHAO-CHIN
To: RALINK TECHNOLOGY CORP.
Reel/Frame 030965/0925 →