Method for modifying surface of metal bipolar plate and bipolar plate for fuel cell
A method for modifying the surface of a metal bipolar plate is provided. The method includes the steps of providing a metal substrate having a conducting adhesion layer on a surface thereof, the metal substrate having a flow field structure at the surface thereof; applying expanded graphite powder onto the conducting adhesion layer; and press-fitting the expanded graphite powder and the metal substrate with a mold structurally corresponding to the flow field structure, to form a graphite layer covering the surface the metal substrate from the expanded graphite powder. A bipolar plate for a fuel cell is further provided.
1. A method for modifying a surface of a metal substrate, comprising the steps of:
providing the metal substrate having a conducting adhesion layer on the surface thereof, wherein the metal substrate is formed with a flow field structure, and the conducting adhesion layer comprises a polymeric adhesive and a plurality of conductive particles;
applying expanded graphite powder on the conducting adhesion layer; and
press-fitting the metal substrate and the expanded graphite powder with a mold structurally corresponding to the flow field structure, so as to form a graphite layer covering the metal substrate.
2. The method of claim 1 , wherein the expanded graphite powder is obtained by acidifying and heating flaked graphite having sizes between mesh 15 and 200.
3. The method of claim 2 , wherein the flaked graphite comprises 40% to 100% of flaked graphite having a mesh number of from 15 to 100, and 0% to 50% of flaked graphite having a mesh number of from 101 to 200.
4. The method of claim 1 , wherein the expanded graphite powder is used in an amount ranging from 5 to 50 mg/cm 2 .
5. The method of claim 1 , wherein the step of press-fitting is performed at a strain ranging from 10 to 1000 kg/cm 2 .
6. The method of claim 1 , wherein the step of press-fitting comprises molding process or rolling process.
7. The method of claim 1 , wherein the conductive particles are made of a material selected from the group consisting of a metal, a metal alloy, a metal carbide, a metal nitride, a carbon particle and a combination thereof.
8. The method of claim 7 , wherein at least one of the metal, the metal carbide and metal nitride comprises gold, platinum, palladium, nickel or chromium.
9. The method of claim 7 , wherein the metal alloy comprises at least two elements selected from the group consisting of gold, platinum, palladium, nickel and chromium.
10. The method of claim 7 , wherein the conductive particles have particle diameters ranging from 10 nm to 100 μm.
11. The method of claim 7 , wherein the carbon particle is made of at least one selected from the group consisting of a graphite material, a carbon nanocapsule, carbon black, a carbon nanotube and a carbon fiber.
12. The method of claim 1 , wherein the conductive particles take 10% to 70% of a volume of the conducting adhesion layer.
13. The method of claim 1 , wherein the polymeric adhesive is at least one selected from the group consisting of a thermosetting resin, a photo-curable resin and a chemically curable resin.
14. The method of claim 1 , wherein the metal substrate comprises a material selected from the group consisting of aluminum, copper, nickel, chromium and stainless steel.