Compositions incorporating dielectric additives for particle formation, and methods of particle formation using same
View Patent ↗A method of forming particles that includes performing a strong force attenuation of a mixture to form pre-particles. The mixture including a base compound and a dielectric additive having an elevated dielectric constant dispersed therein. The pre-particles are then dielectrically spun in an electrostatic field to further attenuate the pre-particles and form the particles.
1. A method of forming particles, comprising:
a. performing a strong force attenuation of a mixture to form pre-particles, the mixture including a base compound and a dielectric additive having an elevated dielectric constant dispersed therein, wherein the elevated dielectric constant is above 5; then
b. subsequent to step a., dielectrically spinning the pre-particles in an electrostatic field to further attenuate the pre-particles and form the particles.
2. The method of claim 1 , wherein the strong force attenuation includes mechanically attenuating the mixture.
3. The method of claim 1 , wherein the base compound is a polymer.
4. The method of claim 3 , further comprising melting the polymer to form a liquid polymer melt, then dielectrically spinning the liquid polymer melt to form polymer particles.
5. The method of claim 1 , wherein the mixture includes a dispersant selected to encourage the dielectric additive to disperse within the base compound.
6. The method of claim 1 , wherein the pre-particles are micronic.
7. The method of claim 1 , wherein the particles are sub-micronic.
8. The method of claim 1 , wherein the pre-particles are formed using any suitable melt blown technique.
9. The method of claim 1 , wherein the pre-particles are formed using a rotating disc.
10. The method of claim 1 , wherein the dielectric additive includes a ceramic dielectric.
11. The method of claim 1 , wherein the dielectric additive includes high-relative permittivity nanoparticles dispersed within the base compound.
12. The method of claim 1 , wherein the mixture includes a viscosity-reduction additive selected to reduce the viscosity of the base compound.
13. The method of claim 1 , wherein the mixture includes a conductivity additive.
14. The method of claim 1 , wherein the mixture includes an ionic liquid.
15. The method of claim 14 , wherein the ionic liquid is mixed with the dielectric additive.
16. The method of claim 13 , wherein the conductive additive is mixed with the dielectric additive.
17. The method of claim 1 , wherein the mixture is substantially solvent-free.
18. The method of claim 1 , wherein the dielectric additive includes polyglycerol-3.