Metal conservation with stripper solutions containing resorcinol
Resist stripping agents useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits and/or liquid crystals with reduced metal and metal alloy etch rates (particularly copper etch rates and TiW etch rates), are provided with methods for their use. The preferred stripping agents contain low concentrations of resorcinol or a resorcinol derivative, with or without an added copper salt, and with or without an added amine to improve solubility of the copper salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.
1. A composition comprising:
(i) a stripper solution comprising dimethyl sulfoxide, tetramethyl ammonium hydroxide, and an alkanolamine, and
(ii) a resorcinol salt present in an amount within a range of 0.02 wt. % to 1 wt. %, based on the weight of the composition; and
wherein the composition has a conservation factor (MCF) ranging from >0 and <1, said MCF being defined as:
MCF =( a−b )/ a,
where ‘a’ is an etch rate determined with the stripper solution and without the resorcinol salt and ‘b’ is an etch rate determined with the stripper solution and with the resorcinol salt.
2. The composition of claim 1 , wherein the composition further includes a protonated resorcinol.
3. The composition of claim 1 , wherein the composition further includes a secondary solvent.
4. The composition of claim 1 , wherein the composition further includes 1,3-dihydroxybenzene.
5. The composition of claim 1 , wherein the composition further includes a metal salt.
6. A composition comprising:
(i) a stripper solution comprising dimethyl sulfoxide, tetramethyl ammonium hydroxide, and an alkanolamine, and
(ii) a protonated resorcinol present in an amount within a range of 0.02 wt. % to 1 wt. %, based on the weight of the composition; and
wherein the composition has a conservation factor (MCF) ranging from >0 and <1, said MCF being defined as:
MCF =( a−b )/ a,
where ‘a’ is an etch rate determined with the stripper solution and without the protonated resorcinol and ‘b’ is an etch rate determined with the stripper solution and with the protonated resorcinol.
7. The composition of claim 6 , wherein the composition further includes a resorcinol salt.
8. The composition of claim 6 , wherein the composition further includes a secondary solvent.
9. The composition of claim 6 , wherein the composition further includes 1,3-dihydroxybenzene.
10. The composition of claim 6 , wherein the composition further includes a metal salt.