Solid thermal simulator sensing device
View Patent ↗A solid thermal simulator sensing device, the device can simulate and sense the thermal characteristics of a perishable element and is easily calibrated to a verifiable standard. The device is fabricated from a single piece of solid material sized to have a thermal mass substantially equal to that of said perishable element. A sensing channel is located within the single piece of solid material. The sensing channel extends from one end towards the center. A temperature sensor is mounted within the sensing channel. The thermal response time of the device is slowed by the single piece of solid material to mimic the thermal properties of the perishable element. A calibration channel is extends from the outer surface of the device to a point adjacent the temperature sensor. A calibration probe may be inserted into the calibration channel to quickly verify the accuracy of the device.
1. A thermal device for simulating and sensing the thermal characteristics of a perishable element in a surrounding atmosphere, comprising:
a) a single piece of solid material having a center, an outer radius, a sensor end, a calibration end and a longitudinal axis;
b) a sensing channel located along said longitudinal axis within said single piece of solid material, said sensing channel extending from said sensor end towards the center of said single piece of solid material;
c) a temperature sensor having a thermal response time, wherein said temperature sensor is mounted within said sensing channel of said single piece of solid material;
d) a calibration channel located parallel to said longitudinal axis within said single piece of solid material, said calibration channel extending from said calibration end towards the center of said single piece of solid material, said calibration channel terminating proximate said temperature sensor; and
e) wherein the thermal response time of said temperature sensor mimics the thermal characteristics of said perishable element, wherein said single piece of solid material has a thermal mass substantially equal to that of said perishable element.
2. A thermal device as recited in claim 1 , wherein said longitudinal axis is along the center line of said single piece of solid material, wherein said temperature sensor is positioned at said center.
3. A thermal device as recited in claim 1 , further comprising a groove within said outer radius for accepting a cable tie.
4. A thermal device as recited in claim 1 , wherein the outer diameter of said material is one to three inches around said temperature sensor.
5. A thermal device as recited in claim 1 , wherein said single piece of solid material is at least one from the group including polyoxymethylene, polytetrafluoroethylene and polyethylene terephthalate.
6. A thermal device as recited in claim 1 , wherein said temperature sensor is potted within said sensing channel.
7. A thermal device as recited in claim 1 , wherein said temperature sensor is part of a thermal probe pressed within said sensing channel.
8. A thermal device as recited in claim 1 , wherein said temperature sensor is at least one from the group including a Platinum RTD, a thermocouple, and a thermistor.
9. A thermal device as recited in claim 8 , wherein said temperature sensor is integrated with circuitry to be remotely read.
10. A method of fabricating a thermal device for simulating and sensing the thermal characteristics of a perishable element, comprising:
a) providing (i) a single piece of solid material and (ii) a temperature sensor having communication leads;
b) machining said single piece of solid material into a generally cylindrical structure having a center, an outer radius, a sensing end, a calibration end and a longitudinal axis;
c) creating a sensing channel extending from said sensing end towards the center along said longitudinal axis;
d) creating a calibration channel extending from said calibration end towards the center parallel to said longitudinal axis;
e) machining a groove within said outer radius for a cable tie; and
f) securing said temperature sensor internally in said sensing channel with said communication leads extending.
11. A method of fabricating a thermal device as recited in claim 10 , wherein said securing step d) includes potting said temperature sensor within said sensing channel.
12. A method of fabricating a thermal device as recited in claim 10 , wherein said securing step d) includes pressing said temperature sensor within said sensing channel.
13. A method of fabricating a thermal device as recited in claim 10 , wherein said machining step b) further includes machining said single piece of solid material to have a thermal mass substantially equal to that of said perishable element.
14. A method of fabricating a thermal device as recited in claim 13 , wherein said machining step b) includes machining said outer radius to between one and three inches.
15. A method of fabricating a thermal device as recited in claim 14 , wherein said providing step a) said temperature sensor is at least one from the group consisting of a Platinum RTD, thermocouple, and thermistor.