IP Library Granted Patent US 8,709,531
Granted Patent B2
US 8,709,531 · App. 13/969,421 · Granted Apr 29, 2014

Liquid composite compositions using non-volatile liquids and nanoparticles and uses thereof

Inventor: Seth A. Miller (Englewood, CO)
Assignee: eSionic ES, Inc.
B05D5/12B05D7/24B05D1/06B05D1/10B05D1/12B05D1/18B05D1/24H01B1/00
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Quick Facts
Patent No.
US 8,709,531
App. No.
13/969,421
Granted
Apr 29, 2014
Kind
B2
Abstract

A solvent composition comprising an organic solvent; dispersed nanoparticles; and a non-volatile electrolyte is provided. A method of forming a liquid composite composition is provided.

Claims (30)

1. A method of forming a liquid composite composition comprising the steps of:

applying a solvent composition to a substrate, the solvent composition comprising:

i) an organic solvent;

ii) nanoparticles, the nanoparticles each having at least one dimension less than 25 nm and being dispersed individually in the solvent composition; and

iii) a non-volatile liquid;

wherein the solvent composition contains at least 20 wt. % of the dispersed nanoparticles; and

removing the organic solvent to form said liquid composite composition.

2. The method according to claim 1 wherein said removing step is done simultaneously with said applying step.

3. The method according to claim 1 wherein said removing step is done after said applying step.

4. The method according to claim 1 wherein said applying step is done by a method selected from the group consisting of: dip coating, spray coating, casting, spin coating, ink-jet printing, embossing, screen printing, and matrix-assisted pulsed laser evaporation.

5. The method according to claim 1 wherein the step of applying the solvent composition to the substrate acts to remove the organic solvent.

6. The method according to claim 1 where the step of removing the organic solvent is done by evaporation.

7. The method according to claim 1 wherein the step of removing the organic solvent comprises heating.

8. The method according to claim 1 wherein the liquid composite composition is formed on the substrate and the substrate is subsequently removed to form a free-standing liquid composite composition.

9. The method according to claim 1 wherein the liquid composite composition formed after the step of removing the organic solvent is subsequently cured by heating or UV radiation.

10. A method of forming a liquid composite composition comprising the steps of:

applying a solvent composition to a substrate, the solvent composition comprising:

i) an organic solvent;

ii) nanoparticles, the nanoparticles each having at least one dimension less than 25 nm and being dispersed individually in the solvent composition; and

iii) a non-volatile electrolyte;

wherein the non-volatile electrolyte comprises an ionic liquid, and the solvent composition contains at least 20 wt. % of the dispersed nanoparticles; and

removing the organic solvent to form said liquid composite composition.

11. The method according to claim 10 wherein said removing step is done simultaneously with said applying step.

12. The method according to claim 10 wherein said removing step is done after said applying step.

13. The method according to claim 10 wherein said applying step is done by a method selected from the group consisting of: dip coating, spray coating, casting, spin coating, ink-jet printing, embossing, screen printing, and matrix-assisted pulsed laser evaporation.

14. The method according to claim 10 wherein the step of applying the solvent composition to the substrate acts to remove the organic solvent.

15. The method according to claim 10 where the step of removing the organic solvent is done by evaporation.

16. The method according to claim 10 wherein the step of removing the organic solvent comprises heating.

17. The method according to claim 10 wherein the liquid composite composition is formed on the substrate and the substrate is subsequently removed to form a free-standing liquid composite composition.

18. The method according to claim 10 wherein the liquid composite composition formed after the step of removing the organic solvent is subsequently cured by heating or UV radiation.

Assignments (2)
MERGER Recorded Apr 27, 2015
From: ESIONIC ES, INC.
To: ESIONIC CORP.
Reel/Frame 035503/0093 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2014
From: MILLER, SETH A.
To: ESIONIC ES, INC.
Reel/Frame 032406/0715 →
Continuity (3)
Division 12027924 · Feb 7, 2008
Provisional Application 60888632 · Feb 7, 2007
Related Publication 20130337189A1 · Dec 19, 2013