IP Library Granted Patent US 9,354,215
Granted Patent B2
US 9,354,215 · App. 13/975,863 · Granted May 31, 2016

Metal to ceramic seal

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Quick Facts
Patent No.
US 9,354,215
App. No.
13/975,863
Granted
May 31, 2016
Kind
B2
Abstract

A gas sensor includes a sensing element formed on a ceramic substrate, an insulator surrounding at least a portion of the sensing element, and a metal shell surrounding at least a portion of the sensing element. The gas sensor further includes a cured ceramic adhesive structure bonded to the insulator and the sensing element, to the insulator and the metal shell, or to the sensing element and the metal shell. The ceramic adhesive structure is disposed so as to mitigate gas leakage through the gas sensor.

Claims (7)

1. A gas sensor comprising:

a sensing element formed on a ceramic substrate and having ceramic outer surfaces;

an insulator surrounding at least a portion of the sensing element;

a metal shell surrounding at least a portion of the insulator; and

a cured ceramic adhesive structure bonded to the insulator and the sensing element, wherein the cured ceramic adhesive structure comprises a plurality of ceramic adhesive layers, and wherein each layer of the plurality of annular ceramic adhesive layers is bonded to at least one other layer of the plurality of ceramic adhesive layers and to the insulator and the metal shell, or to the ceramic outer surfaces of the sensing element and the metal shell.

2. The gas sensor of claim 1 wherein at least two adjoining ceramic adhesive layers have coefficients of thermal expansion that differ from each other.

3. The gas sensor of claim 1 wherein each of the plurality of ceramic adhesive layers has a coefficient of thermal expansion that differs by no more than 3.0×10 −6 m/m/° C. from the coefficient of thermal expansion of each adjoining ceramic adhesive layer to which it is bonded and by no more than 3.0×10 −6 m/m/° C. from the coefficient of thermal expansion of each of the sensing element, the insulator, and the metal shell to which the one of each ceramic adhesive layer is bonded.

Assignments (3)
CHANGE OF NAME Recorded Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2018
From: DELPHI TECHNOLOGIES, INC.
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045109/0947 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2013
From: SCHAEFER, EVAN JD.; POLIKARPUS, KAIUS K.; CHADWICK, WAYNE M.; ALEXANDER, MARK S.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 031082/0628 →