Potting method for lamp chain
View Patent ↗A potting method for a lamp chain includes a) providing a mold having a potting groove; b) providing a fixing support which is fixedly kept in the potting groove; c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixed support; d) potting a potting material into the potting groove and curing the potting material; and e) removing the mold.
1. A potting method for a lamp chain, the method comprising:
a) providing a mold having a potting groove;
b) providing a fixing support which is fixedly kept in the potting groove;
c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixing support;
d) potting a potting material into the potting groove and curing the potting material; and
e) removing the mold,
wherein, in a), the potting groove having a U-shape section contour is provided; and in b) the fixing support consisting of multiple U-shape supports spaced apart is provided,
wherein, in b), the height of the multiple U-shape supports is made to be less than or equal to the depth of the potting groove.
2. The potting method according to claim 1 , wherein, in b), the fixing support made of a flexible material is provided.
3. The potting material according to claim 2 , wherein, in b), the fixing support made of a material the same as the potting material is provided.
4. The potting method according to claim 1 , wherein, in b), the fixing support is clamped in the potting groove.
5. The potting method according to claim 1 , wherein, in c), the printed circuit board is clamped in the fixing support.
6. A potting method for a lamp chain, the method comprising:
a) providing a mold having a potting groove;
b) providing a fixing support which is fixedly kept in the potting groove;
c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixing support;
d) potting a potting material into the potting groove and curing the potting material; and
e) removing the mold,
wherein, in a), the potting groove having a U-shape section contour is provided; and in b) the fixing support consisting of multiple U-shape supports spaced apart is provided,
wherein, in c), the depth of the opening of the U-shape support is made to be greater than the thickness of the printed circuit board.
7. The potting method according to claim 1 , wherein the potting material is epoxy resin, polyurethane modified epoxy resin and polyurethane resin.
8. The potting method according to claim 6 , wherein, in b), the fixing support made of a flexible material is provided.
9. The potting material according to claim 7 , wherein, in b), the fixing support made of a material the same as the potting material is provided.
10. The potting method according to claim 6 , wherein, in b), the fixing support is clamped in the potting groove.
11. The potting method according to claim 6 , wherein, in c), the printed circuit board is clamped in the fixing support.
12. The potting method according to claim 6 , wherein the potting material is epoxy resin, polyurethane modified epoxy resin and polyurethane resin.