Encapsulation of an MEMS component and a method for producing said component
The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed.
1. A method for producing a component comprising a substrate, a chip and a frame, comprising the following sequence of steps:
applying the frame to the substrate;
connecting the chip to the frame by placing the chip onto the frame; and
hermetically sealing a volume enclosed by the substrate, the chip and the frame by means of a metallic closure layer,
wherein the hermetic sealing by means of the metallic closure layer is effected by the metallic closure layer being applied on the frame and the chip over the whole area,
wherein the closure layer is applied by means of at least one of the following:
applying metal particles with a plasma jet,
spraying on metal particles dissolved in a solvent,
vapor deposition of one or a plurality of metal particles,
wherein after the metallic closure layer has been applied, the metallic closure layer is sintered.
2. A method for producing a component comprising a substrate, a chip and a frame, comprising the following sequence of steps:
applying the frame to the substrate;
connecting the chip to the frame by placing the chip onto the frame; and
hermetically sealing a volume enclosed by the substrate, the chip and the frame by means of a metallic closure layer, the metallic closure layer being a multilayer metal foil,
wherein the metallic closure layer is applied to the frame and the chip by means of fusion of the multilayer metal foil with pressurization.
3. The method according to claim 1 , wherein the chip has electrically conductive structures on a side inclined toward the enclosed volume and is interconnected with the substrate by means of at least one bump connection.
4. The method according to claim 1 or 2 , wherein the frame has a planar surface in such a way that the chip bears homogeneously on the frame.
5. The method according to claim 1 or 2 , wherein the chip is a microelectromechanical system, a microelectro optical system, or a microelectro optomechanical system.
6. The method according to claim 1 , wherein metal particles, in particular metallic nano or microparticles, are admixed with the plasma jet.
7. The method according to claim 1 , wherein the metallic closure layer is reinforced by plating.