Bottom reception pin module for electronic component mounting device, substrate bottom reception device, and substrate bottom reception method
View Patent ↗A bottom reception pin module 22 which is allowed to stand upright on a bottom reception base part 21 having a magnetic member 21 a provided on an upper surface to support the substrate includes a base part 23 having a magnet member 26 built therein so as to be freely lifted and lowered and fixed to the bottom reception base part 21 by a magnetization force under a state that the magnet member 26 is lowered and a hollow shaft member 24 extended upward from the base part 23 and having an upper end of a top member 25 abutting on the lower surface of the substrate to support the substrate. By a vacuum suction from a suction hole 25 c , the magnet member 26 is lowered and lifted to fix and unfix the base part 23 relative to the bottom reception base part 21.
1. A bottom reception pin module for an electronic component mounting device which mounts an electronic component on a substrate, the bottom reception pin module being allowed to stand upright in an arbitrary position of a bottom reception base part having a magnetic member provided on at least an upper surface to bear and support the substrate from a lower surface side, the bottom reception pin module comprising:
a base part having a magnet member with a permanent magnetism built therein so as to be freely lifted and lowered and fixed to the bottom reception base part by a magnetization force under a state that the magnet member is lowered; and
a shaft shaped part extended upward from the base part and having an upper end part abutting on the lower surface of the substrate to support the substrate, the shaft shaped part including a suction hole configured to lift the magnetic member by a vacuum suction through the suction hole;
wherein the magnet member is lowered and lifted to fix and unfix the base part to the bottom reception base part.
2. The bottom reception pin module for an electronic component mounting device according to claim 1 , wherein the base part includes a piston which slides together with the magnet member in a lift chamber provided therein to be lifted and lowered, and the suction hole is opened to the upper end part and communicates with the lift chamber to lift the magnet member together with the piston.
3. The bottom reception pin module for an electronic component mounting device according to claim 2 , wherein the suction hole is allowed to communicate with a suction or adsorption hole of a adsorption nozzle attached to a mounting head of the electronic component mounting device to carry out the vacuum suction.
4. A substrate bottom reception device which bears and supports a substrate from a lower surface side in an electronic component mounting device which mounts electronic component on the substrate, the substrate bottom reception device comprising:
a bottom reception base part having a magnetic member provided at least on an upper surface; and
a plurality of bottom reception pin modules allowed to stand upright at arbitrary positions of the bottom reception base part to support the substrate from the lower surface side, wherein the bottom reception pin module includes a base part having a magnet member with a permanent magnetism built therein so as to be freely lifted and lowered and fixed to the bottom reception base part by a magnetization force under a state that the magnet member is lowered and a shaft shaped part extended upward from the base part and having an upper end part abutting on the lower surface of the substrate to support the substrate, and the magnet member is lowered and lifted to fix and unfix the base part to the bottom reception base part.
5. The substrate bottom reception device according to claim 4 , wherein the base part includes a piston which slides together with the magnet member in a lift chamber provided therein to be lifted and lowered, and a vacuum suction from a suction hole is carried out which is provided in the shaft shaped part and opened to the upper end part and communicates with the lift chamber to lift the magnet member together with the piston.
6. A substrate bottom reception method that bears and supports a substrate from a lower surface side in an electronic component mounting device which mounts electronic component on the substrate, wherein:
the substrate bottom reception method uses a substrate bottom reception device including a bottom reception base part having a magnetic member provided at least on an upper surface and a plurality of bottom reception pin modules allowed to stand upright at arbitrary positions of the bottom reception base part to support the substrate from the lower surface side, wherein the bottom reception pin module includes a base part having a magnet member with a permanent magnetism built therein so as to be freely lifted and lowered and fixed to the bottom reception base part by a magnetization force under a state that the magnet member is lowered and a shaft shaped part extended upward from the base part and having an upper end part abutting on the lower surface of the substrate to support the substrate; and
the magnet member is lowered and lifted to fix and unfix the base part relative to the bottom reception base part.