A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and molding resin which covers the semiconductor substrate, the matching circuit substrate, and the thin plate.
1. A resin package comprising:
a die pad having a main surface on which a chip is mounted;
at least one lead terminal electrically connected to the chip;
a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and
sealing resin which covers the chip and the thin plate;
wherein one surface of the thin plate is roughened,
one of the main surface of the die pad and the main surface of the thin plate has a first fixing hole,
the other of the main surface of the die pad and the main surface of the thin plate has a first fixing projection, and
the first fixing hole and the first fixing projection are engaged with each other.
2. The resin package according to claim 1 ,
wherein the thin plate is positioned around the chip on the main surface of the die pad.
3. The resin package according to claim 1 ,
wherein a plurality of the thin plates are positioned at opposite sides of a region where the chip is mounted on the main surface of the die pad.
4. The resin package according to claim 1 ,
wherein the first fixing hole and the first fixing projection are crimped.
5. The resin package according to claim 1 ,
wherein one of the main surface of the at least one lead terminal and a main surface of the thin plate has a second fixing hole,
the other of the main surface of the at least one lead terminal and the main surface of the thin plate has a second fixing projection, and
the second fixing hole and the second fixing projection are engaged with each other.
6. The resin package according to claim 5 ,
wherein the second fixing hole and the second fixing projection are crimped.
7. The resin package according to claim 1 ,
wherein both surfaces of the thin plate are roughened.
8. The resin package according to claim 1 ,
wherein the surface of the thin plate is roughened in advance, before the thin plate is attached to the die pad.
9. The resin package according to claim 1 ,
wherein the thin plate is roughened by forming at least one of grooves or holes.