Elastic wave device and method of manufacturing the device
View Patent ↗An elastic wave device includes a piezoelectric substrate, a comb-shaped electrode above an upper surface of the piezoelectric substrate, a wiring connected to the comb-shaped electrode, an element cover above the upper surface of the piezoelectric substrate for covering the comb-shaped electrode across a space, a first electrode above an upper surface of the element cover, a sealing resin above the upper surface of the piezoelectric substrate for covering the element cover and the first electrode, a terminal electrode above an upper surface of the sealing resin, and a second electrode passing through the sealing resin for electrically connecting the first electrode with the terminal electrode. The first and second electrodes are made of films produced by electro-plating. The diameter of plating particles of the first electrode may be larger than that of plating particles of the second electrode.
1. An elastic wave device comprising:
a piezoelectric substrate;
a comb-shaped electrode disposed above an upper surface of the piezoelectric substrate;
wiring connected to the comb-shaped electrode;
a cover disposed above the upper surface of the piezoelectric substrate, covering the comb-shaped electrode and defining a space between the upper surface of the piezoelectric substrate and the cover;
a first electrode disposed above an upper surface of the cover;
a sealing resin disposed above the upper surface of the piezoelectric substrate and covering the cover and the first electrode;
a terminal electrode disposed above an upper surface of the sealing resin; and
a second electrode passing through the sealing resin and electrically connecting the first electrode with the terminal electrode, the first electrode and the second electrode being made of a metal film produced by electro-plating, and a diameter of plating particles of the first electrode being larger than a diameter of plating particles of the second electrode.
2. An elastic wave device comprising:
a piezoelectric substrate;
a comb-shaped electrode disposed above an upper surface of the piezoelectric substrate;
wiring connected to the comb-shaped electrode;
a cover disposed above the upper surface of the piezoelectric substrate, covering the comb-shaped electrode and defining a space between the upper surface of the piezoelectric substrate and the cover;
a first electrode disposed above an upper surface of the cover;
a sealing resin disposed above the upper surface of the piezoelectric substrate and covering the cover and the first electrode;
a terminal electrode disposed above an upper surface of the sealing resin; and
a second electrode passing through the sealing resin and electrically connecting the first electrode with the terminal electrode, a Young's modulus of the first electrode being smaller than a Young's modulus of the second electrode, the first electrode being formed by matte copper plating and the second electrode being formed by bright copper plating.
3. An elastic wave device comprising:
a piezoelectric substrate;
a comb-shaped electrode provided above an upper surface of the piezoelectric substrate;
wiring connected to the comb-shaped electrode;
a cover disposed above the upper surface of the piezoelectric substrate, covering the comb-shaped electrode and defining a space between the upper surface of the piezoelectric substrate and the cover;
a first electrode disposed above an upper surface of the cover;
a sealing resin disposed above the upper surface of the piezoelectric substrate and covering the cover and the first electrode;
a terminal electrode disposed above an upper surface of the sealing resin; and
a second electrode passing through the sealing resin and electrically connecting the first electrode with the terminal electrode, the first electrode being made of a first metal film produced by matte copper plating, and the second electrode being made of a second metal film produced by bright copper plating.
4. An elastic wave device comprising:
a piezoelectric substrate;
a comb-shaped electrode disposed above an upper surface of the piezoelectric substrate;
wiring connected to the comb-shaped electrode;
a cover disposed above the upper surface of the piezoelectric substrate, covering the comb-shaped electrode and defining a space between the upper surface of the piezoelectric substrate and the cover;
a first electrode disposed above an upper surface of the cover;
a sealing resin disposed above the upper surface of the piezoelectric substrate and covering the cover and the first electrode;
a terminal electrode disposed above an upper surface of the sealing resin; and
a second electrode passing through the sealing resin and electrically connecting the first electrode with the terminal electrode, an internal stress of the first electrode being a tensile stress, and an internal stress of the second electrode being a compressive stress.
5. A method of manufacturing an elastic wave device comprising:
forming a comb-shaped electrode and wiring on an upper surface of a piezoelectric substrate;
forming a cover above the upper surface of the piezoelectric substrate that covers the comb-shaped electrode and defines a space between the upper surface of the piezoelectric substrate and the cover;
forming a first electrode above an upper surface of the cover by matte electrolytic copper plating;
forming a sealing resin above the upper surface of the piezoelectric substrate, the sealing resin covering the cover and the first electrode;
forming an opening passing through the sealing resin and exposing the first electrode from the opening; and
forming a second electrode filling the opening and a terminal electrode above an upper surface of the sealing resin by bright copper electrolytic plating.
6. The method of claim 5 wherein forming the second electrode includes forming the second electrode to have a smaller diameter of plating particles than a diameter of plating particles of the first electrode.
7. The method of claim 5 wherein forming the second electrode includes using a copper sulfate plating solution that includes an additive to control a diameter of plating particles in the second electrode.
8. The elastic wave device of claim 1 wherein a Young's modulus of the first electrode is smaller than a Young's modulus of the second electrode.
9. The elastic wave device of claim 8 wherein a density of the first electrode is less than a density of the second electrode.
10. The elastic wave device of claim 9 wherein the first electrode is formed by matte copper plating and the second electrode is formed by bright copper plating.
11. The elastic wave device of claim 10 wherein an internal stress of the first electrode is a tensile stress and an internal stress of the second electrode is a compressive stress.
12. The elastic wave device of claim 11 wherein the internal stress of the first electrode is smaller than the internal stress of the second electrode.
13. The elastic wave device of claim 12 wherein a conductivity of the second electrode is greater than a conductivity of the first electrode.
14. The elastic wave device of claim 13 wherein a surface of the first electrode is rougher than a surface of the second electrode.
15. The elastic wave device of claim 14 wherein the first electrode is softer than the second electrode.
16. The elastic wave device of claim 1 wherein a density of the first electrode is less than a density of the second electrode.
17. The elastic wave device of claim 1 wherein the first electrode is formed by matte copper plating and the second electrode is formed by bright copper plating.
18. The elastic wave device of claim 1 wherein an internal stress of the first electrode is a tensile stress and an internal stress of the second electrode is a compressive stress, and the internal stress of the first electrode is smaller than the internal stress of the second electrode.
19. The elastic wave device of claim 2 wherein a density of the first electrode is less than a density of the second electrode.
20. The elastic wave device of claim 3 wherein a density of the first electrode is less than a density of the second electrode.
21. The elastic wave device of claim 3 wherein an internal stress of the first electrode is a tensile stress and an internal stress of the second electrode is a compressive stress, and the internal stress of the first electrode is smaller than the internal stress of the second electrode.
22. The elastic wave device of claim 4 wherein the internal stress of the first electrode is smaller than the internal stress of the second electrode.
23. The elastic wave device of claim 22 wherein a density of the first electrode is less than a density of the second electrode.
24. An elastic wave device comprising:
a piezoelectric substrate;
a comb-shaped electrode disposed above an upper surface of the piezoelectric substrate;
wiring connected to the comb-shaped electrode;
a cover disposed above the upper surface of the piezoelectric substrate, covering the comb-shaped electrode and defining a space between the upper surface of the piezoelectric substrate and the cover;
a first electrode disposed above an upper surface of the cover;
a sealing resin disposed above the upper surface of the piezoelectric substrate and covering the cover and the first electrode;
a terminal electrode disposed above an upper surface of the sealing resin; and
a second electrode passing through the sealing resin and electrically connecting the first electrode with the terminal electrode, a Young's modulus of the first electrode being smaller than a Young's modulus of the second electrode, an internal stress of the first electrode being a tensile stress, an internal stress of the second electrode being a compressive stress, and the internal stress of the first electrode being smaller than the internal stress of the second electrode.