Waveguide device, communication module and electronic device
An electronic device includes a central control unit and a waveguide device. The waveguide device includes a communication module having a communication function, and an attachment/detachment unit capable of attaching/detaching a high-frequency signal waveguide so that coupling between the module and the high-frequency signal is possible. The communication module includes a communication device, and a transfer structure configured to cause a high-frequency signal emitted from the communication device to be coupled to the high-frequency signal waveguide.
1. A waveguide device comprising:
a signal processing module configured to communicate with another signal processing module;
an attachment/detachment unit configured to attach/detach to a high-frequency signal waveguide, wherein the attachment/detachment unit is further configured to mount the signal processing module using module fixing walls such that the mounted signal processing module is coupled to the high-frequency signal waveguide attached to the attachment/detachment unit; and
a control unit configured to:
recognize a function of the signal processing module based on a data transmission between the signal processing module and the control unit;
change configuration information based on the recognized function of the signal processing module; and
control a data transmission between the signal processing module and the another signal processing module according to the changed configuration information.
2. The waveguide device according to claim 1 ,
wherein a position of the attachment/detachment unit in the waveguide device is a vertex of a predetermined planar shape or a predetermined three-dimensional shape formed by a plurality of the high-frequency signal waveguides.
3. The waveguide device according to claim 1 , wherein the attachment/detachment unit is configured to decouple each of a plurality of the high-frequency signal waveguides from another of the plurality of the high-frequency signal waveguides.
4. The waveguide device according to claim 1 , wherein the mounted signal processing module is a relay module configured to relay data to the another signal processing module.
5. The waveguide device according to claim 1 , wherein the high-frequency signal waveguide connected to the attachment/detachment unit includes a plurality of independent transmission paths.
6. The waveguide device according to claim 5 , wherein a plurality of members constituting the plurality of independent transmission paths are arranged in parallel in the high-frequency signal waveguide.
7. The waveguide device according to claim 5 , wherein a plurality of members constituting the plurality of independent transmission paths are laminated.
8. The waveguide device according to claim 5 , wherein a plurality of members constituting the plurality of independent transmission paths have different permittivities, wherein a wall layer of a permittivity different from any of the permittivities is arranged between the plurality of members constituting the adjacent independent transmission paths, and wherein an opening is provided in a part of the wall layer.
9. The waveguide device according to claim 1 , wherein a planar shape or a three-dimensional shape formed by a plurality of the high-frequency signal waveguides is predetermined.
10. The waveguide device according to claim 9 , wherein a basic shape is a unit constituting the planar shape or the three-dimensional shape, wherein the basic shape is one of a regular triangle, a regular square, and a regular hexagon.
11. The waveguide device according to claim 1 , wherein the mounted signal processing module transmits data to the another signal processing module in the waveguide device via the high-frequency signal waveguide attached to the attachment/detachment unit.
12. The waveguide device according to claim 1 , wherein the control unit senses a position of the attachment/detachment unit in an arrangement of a plurality of the attachment/detachment units.
13. The waveguide device according to claim 1 , wherein the control unit senses whether the signal processing module is coupled to the high-frequency signal waveguide.
14. The waveguide device according to claim 1 , wherein the mounted signal processing module is a relay module configured to transfer data from a first signal processing module to a second signal processing module.
15. The waveguide device according to claim 1 ,
wherein a plurality of members, constituting a plurality of independent transmission paths in the high-frequency signal waveguide, have different permeabilities,
wherein a wall layer of a permeability different from any of the permeabilities is arranged between the plurality of members constituting the adjacent independent transmission paths, and
wherein an opening is provided in a part of the wall layer.
16. An electronic device comprising:
a signal processing module configured to communicate with another signal processing module;
an attachment/detachment unit configured to attach/detach to a high-frequency signal waveguide so that the signal processing module is coupled to the high-frequency signal waveguide attached to the attachment/detachment unit; and
a control unit configured to change configuration information based on change in coupling of the signal processing module to the high-frequency signal waveguide, and to control data transmission according to the changed configuration information.
17. A waveguide device comprising:
a module configured to communicate with another module; and
an attachment/detachment unit configured to attach/detach a high-frequency signal waveguide,
wherein the high-frequency signal waveguide connected to the attachment/detachment unit includes a plurality of independent transmission paths,
wherein members constituting the plurality of independent transmission paths have different permeabilities, a wall layer of a permeability different from any of the permeabilities is arranged between the members constituting adjacent transmission paths, and an opening is provided in a part of the wall layer.