Reflow treating unit and substrate treating apparatus
Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber. The exhaust member includes a plurality of individual exhaust lines connecting a plurality of process chambers to each other and a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module.
1. An apparatus treating apparatus comprising:
a load port on which a carrier accommodating a substrate is seated;
a substrate treating module comprising one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate; and
a substrate transfer module comprising a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module,
wherein the reflow treating unit comprises:
a process chamber having a treating space therein; and
an exhaust member exhausting a fluid within the process chamber,
wherein the exhaust member comprises:
a plurality of individual exhaust lines connecting a plurality of process chambers to each other; and
a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module, wherein the exhaust member further comprises a trap removing impurities of the exhausted fluid, wherein the trap is provided in plurality, and the plurality of traps are disposed on the plurality of individual exhaust lines, respectively, wherein the trap is separable from each of the plurality of individual exhaust lines; and wherein the plurality of process chambers are arranged in a circular ring shape, the common exhaust line is disposed at a center of the ring shape, and wherein each of the individual exhaust lines radially extends from the center of the ring shape when viewed from an upper side.
2. The apparatus treating apparatus of claim 1 , wherein the individual exhaust lines are connected to upper portions of the process chambers, respectively.
3. The apparatus treating apparatus of claim 1 , wherein the process chamber comprises:
a lower housing; and
an upper housing disposed to face the lower housing,
wherein the reflow treating unit further comprises:
a rotation plate having one substrate hole or a plurality of substrate holes in which the substrate is fixed, the rotation plate being disposed between the upper housing and the lower housing;
a driver rotating the rotation plate; and
an elevation member elevating the lower housing to open or close the process chamber.
4. A reflow treating unit comprising:
a plurality of process chambers each having a treating space therein; and
an exhaust member exhausting fluids within the plurality of process chambers,
wherein the exhaust member comprises:
a plurality of individual exhaust lines connecting the plurality of process chambers to each other; and
a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module, wherein the exhaust member further comprises a trap removing impurities of the exhausted fluid, wherein the trap is provided in plurality, and
the plurality of traps are disposed on the plurality of individual exhaust lines, respectively; wherein each trap is separable from each of the plurality of individual exhaust lines, and wherein the plurality of process chambers are arranged in a circular ring shape, the common exhaust line being disposed at a center of the ring shape, and each of the individual exhaust lines radially extends from the center of the ring shape when viewed from an upper side.
5. The reflow treating unit of claim 4 , wherein each of the process chambers comprises:
a lower housing; and
an upper housing disposed to face the lower housing,
wherein the reflow treating unit further comprises:
a rotation plate having one substrate hole or a plurality of substrate holes in which the substrate is fixed, the rotation plate being disposed between the upper housing and the lower housing;
a driver rotating the rotation plate; and
an elevation member elevating the lower housing to open or close each of the process chambers.