IP Library Granted Patent US 9,306,111
Granted Patent B2
US 9,306,111 · App. 13/988,302 · Granted Apr 5, 2016

Semiconductor material and method of production

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Quick Facts
Patent No.
US 9,306,111
App. No.
13/988,302
Granted
Apr 5, 2016
Kind
B2
Abstract

A method of manufacturing (Ag x Cu 1-x ) 2 ZnSn(S y Se 1-y ) 4 thin films, the method comprising: providing a thin film comprising Ag and/or Cu, the thin film further comprising Zn and annealing the thin film in an atmosphere comprising S and/or Se, and further comprising Sn.

Claims (16)

1. A method of manufacturing (Ag x Cu 1-x ) 2 ZnSn(S y Se 1-y ) 4 thin films, where x and y are independently between 0 and 1, the method comprising:

providing a thin film comprising Ag and/or Cu, the thin film further comprising Zn; and

annealing the thin film in an atmosphere comprising S and/or Se, and further comprising Sn, wherein the annealing comprises providing an Sn source in the presence of reactive S and/or Se external to the thin film, and heating the Sn source in a non-vacuum atmosphere to an elevated temperature and pressure in the presence of the thin film;

wherein a vapor pressure of Sn or Sn compounds in the atmosphere essentially in contact with a surface of the thin film is higher than any partial pressure of Sn present in the thin film whereby Sn from the Sn source is provided to the thin film.

2. The method in accordance with claim 1 , wherein the thin film provided prior to annealing further comprises Sn.

3. The method in accordance with claim 1 , wherein the thin film provided prior to annealing further comprises S and/or Se.

4. The method in accordance with claim 1 , wherein the Sn source is an Sn-containing composition further comprising S or Se.

5. The method in accordance with claim 1 , wherein the step of annealing the thin film further comprises enclosing the thin film and the atmosphere in an inert enclosure.

6. The method in accordance with claim 5 , wherein at least one opening is provided in the enclosure.

7. The method in accordance with claim 1 , wherein the thin film is provided on a substrate.

8. The method in accordance with claim 7 , wherein the substrate is molybdenum.

9. The method in accordance with claim 1 , wherein the thin film comprises at least one layer comprising Zn.

10. The method in accordance with claim 1 , wherein the thin film comprises at least one layer comprising Ag and/or Cu.

11. The method in accordance with claim 1 , wherein the thin film comprises at least one layer comprising S and/or Se.

12. The method in accordance with claim 1 , wherein the thin film comprises at least one layer comprising Sn.

13. The method in accordance with claim 1 , wherein the Sn source external to the thin film further comprises a gas flow comprising Sn and reactive S/Se.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2013
From: BERG, DOMINIK; REDINGER, ALEX; DALE, PHILLIP; SIEBENTRITT, SUSANNE
To: UNIVERSITE DU LUXEMBOURG; TDK CORPORATION
Reel/Frame 030662/0432 →
CHANGE OF ADDRESS Recorded Jun 12, 2013
From: TDK CORPORATION
To: TDK CORPORATION
Reel/Frame 030651/0687 →