Photosensitive composition comprising an acrylate compound
The present invention relates to a photosensitive composition including an acrylate-based compound having an adamantyl structure. It is possible to manufacture an organic thin film that is easily stripped without decreasing the strength of the thin film by using the photosensitive composition.
1. A photosensitive composition comprising:
a binder resin including an alkali soluble polymer resin;
a crosslinking compound;
a photopolymerization initiator;
a compound represented by the following Formula 1; and
a solvent:
wherein
at least one of R 1 to R 4 is represented by the following Formula 2, Formula 3, Formula 4, or Formula 5, and
the rest are selected from the group consisting of hydrogen, a halogen group, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, and a haloalkyl group having 1 to 5 carbon atoms,
wherein
R 5 , R 6 , R 7 and R 8 are the same as or different from each other, and each is independently hydrogen, or an alkyl group having 1 to 5 carbon atoms,
wherein a content of the compound represented by the Formula 1 is 0.8 to 4 wt % on the basis of a total weight of the photosensitive composition, and
wherein a content of the compound represented by the Formula 1 is 5 to 25 wt % on the basis of a weight of the crosslinking compound.
2. The photosensitive composition according to claim 1 , wherein R 1 and R 2 of Formula 1 are each independently represented by Formula 2, Formula 3, Formula 4 or Formula 5, and R 3 and R 4 are hydrogen.
3. The photosensitive composition according to claim 1 , wherein Formula 1 is represented by any one of the following Formula 6 to Formula 13:
4. The photosensitive composition according to claim 1 , wherein the binder resin is an acryl binder resin including a carboxyl group.
5. The photosensitive composition according to claim 1 , wherein a content of the binder resin is 1 to 20 wt % on the basis of a total weight of the photosensitive composition.
6. The photosensitive composition according to claim 1 , wherein a content of the crosslinking compound is 1 to 30 wt % on the basis of a total weight of the photosensitive composition.
7. The photosensitive composition according to claim 1 , wherein a content of the photopolymerization initiator is 0.1 to 5 wt % on the basis of a total weight of the photosensitive composition.
8. The photosensitive composition according to claim 1 , wherein a content of the solvent is 45 to 95 wt % on the basis of a total weight of the photosensitive composition.
9. The photosensitive composition according to claim 1 , further comprising:
one or more selected from the group consisting of a colorant, a curing accelerator, a thermal polymerization inhibitor, a surfactant, a photosensitizer, a plasticizer, an adhesion promoter, and a filler.
10. The photosensitive composition according to claim 1 , wherein the photosensitive composition is selected from the group consisting of a photosensitive composition for a touch panel protection material, a photosensitive composition for a color filter, a black matrix photosensitive composition, a photosensitive composition for an overcoat layer, a photosensitive composition for a column spacer, a photosensitive composition for a photocurable paint, a photosensitive composition for photocurable ink, a photosensitive composition for a photocurable adhesive agent, a photosensitive composition for a printed board, and a photosensitive composition for a printed circuit board.
11. A photosensitive material comprising the photosensitive composition of claim 1 , wherein the photosensitive material is selected from the group consisting of a photosensitive material for a touch panel protection material, a pigment dispersion photosensitive material for manufacturing a color filter, a photosensitive material for forming a black matrix, a photosensitive material for forming an overcoat layer, a column spacer photosensitive material, and a photosensitive material for a printed circuit board.