Light-emitting diode, light-emitting diode lamp, and illumination device

1. A light-emitting diode comprising:

a light-emitting portion which has an active layer of a quantum well structure, in which a well layer made of a compound semiconductor having a composition formula (In X1 Ga 1-X1 )As (0≦X1≦1) and a barrier layer made of a compound semiconductor having a composition formula (Al X2 Ga 1-X2 )As (0.1≦X2≦0.3) are alternately laminated, a first guide layer and a second guide layer sandwiching the active layer, a first clad layer which is formed on a bottom surface of the first guide layer, and a second clad layer which is formed on an upper surface of the second guide layer;

an electric current diffusion layer which is formed on the light-emitting portion; and

a functional substrate which is bonded to the electric current diffusion layer,

wherein the first and second guide layers are made of a compound semiconductor having a composition formula (Al X6 Ga 1-X6 )As (0.2≦X6≦0.5), and X2≦X6,

the first and second clad layers are made of a compound semiconductor having a composition formula (Al X3 Ga 1-X3 ) Y1 In 1-Y1 P (0≦X3≦1, 0≦Y1≦1), and

the number of paired layers of the well layer and the barrier layer is equal to or smaller than 5.

2. The light-emitting diode according to claim 1 , wherein the total surface area of the active layer in contact with the first clad layer or the second clad layer is 20,000 to 90,000 μm 2 .

3. The light-emitting diode according to claim 1 , wherein the In composition X1 of the well layer is 0≦X1≦0.3, and the thickness of the well layer is 3 to 10 nm.

4. The light-emitting diode according to claim 1 , wherein the In composition X1 of the well layer is 0.1≦X1≦0.3.

5. The light-emitting diode according to claim 1 , wherein the functional substrate is transparent to a light-emission wavelength.

6. The light-emitting diode according to claim 1 , wherein the functional substrate is made of GaP, sapphire, or SiC.

7. A light-emitting diode comprising:

a light-emitting portion which has an active layer of a quantum well structure, in which a well layer made of a compound semiconductor having a composition formula (In X1 Ga 1-X1 )As (0≦X1≦1) and a barrier layer made of a compound semiconductor having a composition formula (Al X2 Ga 1-X2 )As (0.1≦X2≦0.3) are alternately laminated, a first guide layer and a second guide layer sandwiching the active layer, a first clad layer which is formed on a bottom surface of the first guide layer, and a second clad layer which is formed on an upper surface of the second guide layer;

an electric current diffusion layer which is formed on the light-emitting portion; and

a functional substrate which includes a reflecting layer arranged to face the light-emitting portion and having reflectance equal to or greater than 90% with respect to a light-emission wavelength, and is bonded to the electric current diffusion layer,

wherein the first and second guide layers are made of a compound semiconductor having a composition formula (Al X6 Ga 1-X6 )As (0.2≦X6≦0.5), and X2<X6,

the first and second clad layers are made of a compound semiconductor having a composition formula (Al X3 Ga 1-X3 ) Y1 In 1-Y1 P (0≦X3≦1, 0<Y1≦1), and

the number of paired layers of the well layer and the barrier layer is equal to or smaller than 5.

8. The light-emitting diode according to claim 7 , wherein the total surface area of the active layer in contract with the first clad layer or the second clad layer is 20,000 to 90,000 μm 2 .

9. The light-emitting diode according to claim 7 , wherein the In composition X1 of the well layer is 0≦X1≦0.3, and the thickness of the well layer is 3 to 10 nm.

10. The light-emitting diode according to claim 7 , wherein the In composition X1 of the well layer is 0.1≦X1≦0.3.

11. The light-emitting diode according to claim 7 , wherein the functional substrate includes a layer which is made of silicon or germanium.

12. The light-emitting diode according to claim 7 , wherein the functional substrate includes a metal substrate.

13. The light-emitting diode according to claim 12 , wherein the metal substrate has two metal layers or more.

14. The light-emitting diode according to any one of claims 1 and 7 , wherein the number of paired layers of the well layer and the barrier layer is equal to or smaller than 3.

15. The light-emitting diode according to any one of claims 1 and 7 , wherein the electric current diffusion layer is made of GaP.

16. The light-emitting diode according to any one of claims 1 and 7 , wherein the thickness of the electric current diffusion layer is in a range of 0.5 to 20 μm.

17. The light-emitting diode according to any one of claims 1 and 7 , wherein the lateral surface of the functional substrate has a vertical surface perpendicular to a principal light extraction surface on a side near the light-emitting portion, and has an inclined surface inwardly inclined with respect to the principal light extraction surface on a side away from the light-emitting portion.

18. The light-emitting diode according to claim 17 , wherein the inclined surface includes a rough surface.

19. The light-emitting diode according to claim 17 , wherein a first electrode and a second electrode are provided on the principal light extraction surface side of the light-emitting diode.

20. The light-emitting diode according to claim 19 , wherein the first electrode and the second electrode are ohmic electrodes.

21. A light-emitting diode lamp comprising the light-emitting diode according to any one of claims 1 and 7 .

22. An illumination device comprising at least two of the light-emitting diodes according to any one of claims 1 , 7 .