IP Library Granted Patent US 9,303,847
Granted Patent B2
US 9,303,847 · App. 13/990,838 · Granted Apr 5, 2016

Process for producing an LED lamp and a corresponding LED lamp

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,303,847
App. No.
13/990,838
Granted
Apr 5, 2016
Kind
B2
Abstract

A method for producing an LED lamp includes a lamp housing wherein at least one carrier circuit board equipped with LEDs is inserted into the lamp housing in such a way that at least a subregion of the lamp housing protrudes beyond the carrier circuit board with a projection, and the projection is at least partially deformed after insertion in such a way that the lamp housing is pressed with the carrier circuit board.

Claims (12)

1. A method for producing an LED lamp comprising:

inserting at least one carrier circuit board equipped with LEDs into a lamp housing sufficiently far that at least a subregion of the lamp housing protrudes beyond the carrier circuit board forming a projection, and

at least partially deforming the projection after insertion in such a way that the lamp housing is pressed with the carrier circuit board,

wherein, during the deformation of the projection, a die is laid onto the carrier circuit board and interacts with a forming tool.

2. The method of claim 1 wherein a deformed portion of the projection comprises a notch.

3. The method of claim 1 wherein the lamp housing is formed in one or more parts.

4. The method of claim 1 , wherein the carrier circuit board is inserted or pushed into the lamp housing in a form fitting manner.

5. The method of claim 1 , wherein a carrier circuit board bed is formed in the lamp housing.

6. The method of claim 1 , wherein at least one insulating layer is inserted between the lamp housing and the carrier circuit board.

7. The method of claim 1 , wherein a cover is laid on a side of the carrier circuit board which is remote from the lamp housing.

8. The method of claim 1 , wherein the carrier circuit board is manufactured from FR4, ceramic or from a metal-core circuit board.

9. The method of claim 1 , wherein the lamp housing is in the form of a heat sink.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2020
From: OSRAM GMBH
To: LEDVANCE GMBH
Reel/Frame 053144/0291 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2013
From: DELLIAN, HARALD; OTZEN, STEFAN; REINGRUBER, FABIAN; SCHMACHT, THOMAS
To: OSRAM GMBH
Reel/Frame 030520/0637 →