Semiconductor laser module and method for manufacturing same
View Patent ↗A semiconductor laser module includes a laser diode array, an optical fiber array, a fiber array fitting for fixing the optical fiber array, a casing, and a support fitting for fixing the fiber array fitting and casing. The fiber array fitting and support fitting have a first contact section that is in line-contact or surface-contact with the plane section parallel with the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the first contact section. The support fitting and casing have a second contact section that is in line-contact or surface-contact with the plane section vertical to the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the second contact section.
1. A semiconductor laser module comprising:
a laser diode array;
an optical fiber array having optical fibers arranged on a substrate;
a fiber array fitting for fixing the optical fiber array;
a casing for supporting at least the laser diode array and the optical fiber array; and
a support fitting for fixing the fiber array fitting and the casing,
wherein the support fitting has a plane section parallel with the casing and two columnar sections extending vertically from right and left corners on an end surface on the laser diode array side in the plane section,
wherein the fiber array fitting has a first contact section that is in line-contact or surface-contact with each of the two columnar sections of the support fitting, and the fiber array fitting and the support fitting are fixed to each other by a first laser welded section in the first contact section, and
wherein the plane section of the support fitting has a second contact section that is in line-contact or surface-contact with the casing, and the support fitting and the casing are fixed to each other by a second laser welded section in the second contact section.
2. The semiconductor laser module of claim 1 , wherein
the fiber array fitting has a projecting section at each of right and left ends, and a contact surface of each of the projecting sections comes into contact with a contact surface of each of the right and left columnar sections of the support fitting to form the first contact section.
3. The semiconductor laser module of claim 1 , wherein
when the optical fiber array is aligned, the support fitting, due to the own weight, is in line-contact or surface-contact with the casing on the plane section that is vertical to a light emission surface of the laser diode array.
4. The semiconductor laser module of claim 1 , further comprising:
a guide pin for guiding the support fitting so that the support fitting follows movement of the fiber array fitting in a plane that is vertical to a light emission surface of the laser diode array,
wherein the guide pin is press-fitted into the support fitting.
5. The semiconductor laser module of claim 1 , wherein
the fiber array fitting is arranged above the plane section of the support fitting, and the fiber array fitting and the plane section of the support fitting are fixed apart from each other.
6. A semiconductor laser module comprising:
a laser diode array;
an optical fiber array having optical fibers arranged on a substrate;
a fiber array fitting for fixing the optical fiber array;
a casing for supporting at least the laser diode array and the optical fiber array; and
a support fitting for fixing the fiber array fitting and the casing,
wherein the fiber array fitting and the support fitting have a first contact section that is in line-contact or surface-contact with a plane section parallel with a light emission surface of the laser diode array, and are fixed to each other by a first laser welded section in the first contact section,
wherein the support fitting and the casing have a second contact section that is in line-contact or surface-contact with a plane section vertical to the light emission surface of the laser diode array, and are fixed to each other by a second laser welded section in the second contact section, and
wherein, when the optical fiber array is aligned, the support fitting, due to the own weight, is in line-contact or surface-contact with the casing on a plane section vertical to the light emission surface of the laser diode array.
7. A semiconductor laser module comprising:
a laser diode array;
an optical fiber array having optical fibers arranged on a substrate;
a fiber array fitting for fixing the optical fiber array;
a casing for supporting at least the laser diode array and the optical fiber array; and
a support fitting for fixing the fiber array fitting and the casing,
wherein the fiber array fitting and the support fitting have a first contact section that is in line-contact or surface-contact with a plane section parallel with a light emission surface of the laser diode array, and are fixed to each other by a first laser welded section in the first contact section,
wherein the support fitting and the casing have a second contact section that is in line-contact or surface-contact with a plane section vertical to the light emission surface of the laser diode array, and are fixed to each other by a second laser welded section in the second contact section, and
wherein the semiconductor laser module further comprises a guide pin for guiding the support fitting so that the support fitting follows movement of the fiber array fitting in a plane that is vertical to the light emission surface of the laser diode array, the guide pin being press-fitted into the support fitting.
8. A method of manufacturing a semiconductor laser module, the semiconductor laser module including:
a laser diode array;
an optical fiber array having optical fibers arranged on a substrate;
a fiber array fitting for fixing the optical fiber array;
a casing for supporting at least the laser diode array and the optical fiber array; and
a support fitting for fixing the fiber array fitting and the casing,
wherein the fiber array fitting and the support fitting have a first contact section that is in line-contact or surface-contact with a plane section parallel with a light emission surface of the laser diode array, and are fixed to each other by a first laser welded section in the first contact section,
wherein the support fitting and the casing have a second contact section that is in line-contact or surface-contact with a plane section vertical to the light emission surface of the laser diode array, and are fixed to each other by a second laser welded section in the second contact section,
the method of manufacturing the semiconductor laser module comprising:
a first mating step of performing Xθ alignment by mating the fiber array fitting with the support fitting at the first contact section;
a five-axis alignment step of performing five-axis alignment of the optical fibers to the light emission surface of the laser diode array;
a step of storing alignment coordinates of six axes of the optical fiber array, the alignment coordinates being obtained in the first mating step and the five-axis alignment step;
a moving step of moving the fiber array fitting by a predetermined distance in the positive direction of a Z axis;
a moving-again step of moving the fiber array fitting to the stored alignment coordinates of the six axes again after the moving step;
a second mating step of mating the fiber array fitting with the support fitting at the first contact section in the alignment coordinates of the six axes; and
a laser welding step of forming the first laser welded section and the second laser welded section in the first contact section and the second contact section.
9. The method of manufacturing the semiconductor laser module of claim 8 , wherein
the fiber array fitting is arranged above the plane section of the support fitting, and the fiber array fitting and the plane section of the support fitting are fixed apart from each other.