ELECTRICAL MODULE FOR BEING RECEIVED BY AUTOMATIC PLACEMENT MACHINES BY MEANS OF GENERATING A VACUUM
The invention relates to an electrical module ( 100 ) for being received by automatic placement machines by means of generating a vacuum, comprising a carrier substrate ( 10 ), at least one component ( 20, 21 ) disposed on the carrier substrate ( 10 ), and a cover element ( 30 ) disposed above the at least one component ( 20, 21 ). A fixing component ( 40 ) by which the cover element ( 30 ) is attached to the at least one component ( 21 ) is disposed between the cover element ( 30 ) and the at least one component ( 21 ). The cover element can be implemented as a dimensionally stable, flat film by means of which it is possible to suction the module by means of vacuum for a placement method, and to place said module at a position on a circuit board.
1 . An electrical module for being received by automatic placement machines by means of generating a vacuum, comprising:
a carrier substrate;
at least one component which is arranged on the carrier substrate; and
a covering element which is arranged above the at least one component,
wherein a fixing component, by means of which the covering element is fastened to the at least one component, is arranged between the covering element and the at least one component.
2 . The electrical module according to claim 1 , further comprising:
at least one further component which has a lower overall height than the at least one component,
wherein the fixing component is applied on the at least one component, and
wherein an air gap or a filling material is arranged between the at least one further component and the covering element.
3 . The electrical module according to claim 1 or 2 , wherein the covering element is arranged above the carrier substrate in such a way that a section of the covering element, which section comprises the outer edge of the covering element, is arranged at a distance from the carrier substrate by an air gap.
4 . The electrical module according to claim 1 , wherein the fixing component is in the form of an adhesive layer, in particular in the form of an adhesive layer which is composed of an epoxide or a silicone.
5 . The electrical module according to claim 1 , wherein the fixing component has an electrically insulating material.
6 . The electrical module according to claim 1 , wherein the covering element has a conductive material.
7 . The electrical module according to claim 1 ,
wherein the covering element is coated with a conductive material on a side which faces the carrier substrate, and
wherein the conductive material is arranged between the adhesive layer and the covering element.
8 . The electrical module according to claim 6 or 7 , further comprising:
a coupling element for establishing electrical coupling between the conductive material and the carrier substrate,
wherein the coupling element is arranged on the carrier substrate.
9 . The electrical module according to claim 8 , comprising:
a layer for fixing the coupling element between the carrier element and the covering element,
wherein the layer for fixing the coupling element contains a material which has a higher resistance than the material of the coupling element, and
wherein the layer for fixing the coupling element is arranged on the carrier substrate.
10 . The electrical module according to claim 8 , wherein the coupling element has a conductive adhesive or a conductive coating or a material which is composed of metal.
11 . A method for producing an electrical module for being received by automatic placement machines by means of generating a vacuum, comprising:
providing a carrier substrate;
fitting the carrier substrate with at least one component; and
arranging a covering element above the at least one component by fastening the covering element on the at least one component by means of a fixing component.
12 . The method according to claim 11 , further comprising:
fitting the carrier substrate with at least one further component, wherein the at least one further component has a lower overall height than the at least one component; and
applying the fixing component, in particular an adhesive layer, on the at least one component.
13 . The method according to claim 11 , further comprising:
applying an adhesive layer on a side of the covering element, which side faces the carrier substrate after the step of arranging the covering element above the at least one component.
14 . The method according to one of claims 11 to 13 , further comprising:
coating a side of the covering element, which side faces the carrier substrate after the step of arranging the covering element above the at least one component, with a conductive material;
arranging a coupling element on the carrier substrate in order to establish electrical coupling between the conductive material and the carrier substrate; and
pressing the covering element on the coupling element in such a way that the coupling element displaces the fixing component at one point and the conductive material makes contact with the coupling element at said point.
15 . The method according to claim 14 , further comprising:
applying a layer for fixing the coupling element between the carrier substrate and the covering element on the carrier substrate;
making a cavity in the layer for fixing the coupling element; and
inserting the coupling element into the cavity.