DIELECTRIC ELEMENT BASE MATERIAL, METHOD FOR PRODUCING SAME, AND PIEZOELECTRIC ELEMENT USING SAID DIELECTRIC ELEMENT BASE MATERIAL
A dielectric element substrate includes a board, a diffusion layer, a first isolation layer, and a lower electrode layer. The diffusion layer is provided on the board. The first isolation layer is provided on and unitarily with the diffusion layer. The lower electrode layer is provided on the first isolation layer at an opposite side with respect to the diffusion layer of, and is isolated from the diffusion layer by the first isolation layer. The diffusion layer is formed by allowing a first metal element and a second metal element to diffuse from the board to the same composition material as that of the first isolation layer. The first isolation layer is free from the first and second metal elements. A coefficient of thermal expansion of the diffusion layer decreases monotonously from the board to the first isolation layer.
1 . A dielectric element substrate comprising:
a board including a first metal element and a second metal element;
a diffusion layer provided on the board;
a first isolation layer provided on and unitarily with the diffusion layer; and
a lower electrode layer provided on the first isolation layer at an opposite side with respect to the diffusion layer so as to be isolated from the diffusion layer by the first isolation layer,
wherein the diffusion layer is formed by allowing the first metal element and the second metal element to diffuse from the board to same material as that of the first isolation layer,
the first isolation layer is free from the first metal element and the second metal element, and
a coefficient of thermal expansion of the diffusion layer monotonously decreases from the board to the first isolation layer.
2 . The dielectric element substrate according to claim 1 , wherein a concentration gradient of the first metal element and a concentration gradient of the second metal element of the diffusion layer are different from each other in a direction from the board to the first isolation layer.
3 . The dielectric element substrate according to claim 1 , wherein the first metal element is iron, and the second metal element is chromium.
4 . The dielectric element substrate according to claim 3 , wherein a diffusion length of chromium is larger than a diffusion length of iron in a direction from the board to the first isolation layer.
5 . The dielectric element substrate according to claim 1 , wherein the first isolation layer is formed of silicon oxide.
6 . The dielectric element substrate according to claim 1 , further comprising a second isolation layer provided between the first isolation layer and the lower electrode layer, having a coefficient of thermal expansion larger than that of the first isolation layer, and having smaller diffusion of the first metal element and the second metal element than that in the first isolation layer.
7 . A method for producing a dielectric element substrate, the method comprising:
forming an intermediate layer on a board including a first metal element and a second metal element;
forming a diffusion layer adjacent to the board in the intermediate layer by allowing the first metal element and the second metal element to diffuse from the board, and forming a first isolation layer, which is free from the first metal element and the second metal element, at an opposite side to the board of the intermediate layer; and
forming a lower electrode layer on the first isolation layer at an opposite side to the diffusion layer,
wherein the diffusion layer is formed in such a manner that a coefficient of thermal expansion of the diffusion layer monotonously decreases from the board to the first isolation layer.
8 . The method for producing a dielectric element substrate according to claim 7 , wherein the diffusion layer is formed in such a manner that a concentration gradient of the first metal element and a concentration gradient of the second metal element are different from each other in a direction from the board to the first isolation layer.
9 . The method for producing a dielectric element substrate according to claim 7 , wherein when the intermediate layer is formed, a precursor solution for forming the intermediate layer is applied on the board, thus forming a precursor film; and
when the diffusion layer is formed, the precursor film is crystallized by heating and cooling, and the first metal element and the second metal element are diffused from the board to the precursor film.
10 . The method for producing a dielectric element substrate according to claim 7 , wherein the first metal element is iron, and the second metal element is chromium.
11 . A piezoelectric element comprising:
the dielectric element substrate as defined in claim 1 ;
a piezoelectric layer provided on the lower electrode layer of the dielectric element substrate; and
an upper electrode layer provided on the piezoelectric layer.
12 . The piezoelectric element according to claim 11 , wherein a coefficient of thermal expansion of the board is larger than a coefficient of thermal expansion of the piezoelectric layer.