IP Library Granted Patent US 9,182,100
Granted Patent B2
US 9,182,100 · App. 14/002,760 · Granted Nov 10, 2015

Lighting device

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Quick Facts
Patent No.
US 9,182,100
App. No.
14/002,760
Granted
Nov 10, 2015
Kind
B2
Abstract

A lighting device may include a plurality of semiconductor light sources arranged on a substrate which is brought into contact thermally with a heat sink, wherein the substrate is formed from a multiplicity of substrate modules which are held by a carrier and which each carry at least one semiconductor light source and are brought into contact electrically with one another.

Claims (19)

1. A lighting device comprising a plurality of semiconductor light sources arranged on a substrate which is brought into contact thermally with a heat sink, wherein the substrate is formed from a multiplicity of substrate modules which are held by a carrier and which each carry at least one semiconductor light source and are brought into contact electrically with one another;

wherein the substrate modules are attached to a reflector; and

wherein the reflector has a multiplicity of cutouts on the rear side, a substrate module being inserted into each of said cutouts.

2. The lighting device as claimed in patent claim 1 , wherein the substrate module substantially consists of ceramic.

3. The lighting device as claimed in patent claim 1 , wherein the reflector carries a multiplicity of substrate modules.

4. The lighting device as claimed in patent claim 1 , wherein the substrate module has two conductor tracks for making contact with the semiconductor light sources.

5. The lighting device as claimed in patent claim 4 , wherein the conductor tracks are arranged approximately parallel to one another and the semiconductor light sources are arranged along the conductor tracks.

6. The lighting device as claimed in patent claim 4 , wherein the conductor tracks of a substrate module at the end side are electrically connected to one another.

7. The lighting device as claimed in patent claim 1 , wherein a plurality of LEDs are combined to form a multichip LED.

8. The lighting device as claimed in claim 1 , wherein the substrate modules are brought into contact electrically via bridges extending between adjacent modules.

9. The lighting device as claimed in patent claim 8 , wherein the bridges are attached to the reflector.

10. The lighting device as claimed in patent claim 9 , wherein the bridges are inserted into the reflector in a force-locking manner.

11. The lighting device as claimed in patent claim 1 , wherein the substrate modules are arranged, in a manner lying one behind another, in a tube formed by a cover and heat sink.

12. The lighting device as claimed in patent claim 1 , wherein the substrate modules are inserted into walls of a three-dimensionally embodied reflector.

13. The lighting device as claimed in patent claim 1 , wherein a layer composed of thermal interface material is assigned to the heat sink.

14. A lighting device comprising a plurality of semiconductor light sources arranged on a substrate which is brought into contact thermally with a heat sink, wherein the substrate is formed from a multiplicity of substrate modules which are held by a carrier and which each carry at least one semiconductor light source and are brought into contact electrically with one another; and

wherein the substrate modules are brought into contact electrically via bridges extending between conductor tracks of the substrate modules.

15. The lighting device as claimed in patent claim 8 , wherein the bridges are integrated into the reflector.

16. The lighting device as claimed in patent claim 14 , wherein the bridges are inserted into the reflector in a force-locking manner.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2023
From: OSRAM GMBH
To: OPTOTRONIC GMBH
Reel/Frame 064308/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2013
From: REINGRUBER, FABIAN
To: OSRAM GMBH
Reel/Frame 031124/0602 →