Assembly having a substrate, an SMD component, and a lead frame part

1. An assembly comprising:

a substrate embodied from an electrically insulating material having a depression formed in a face of the substrate;

an SMD component arranged in the depression and having lateral contact surfaces; and

a stamped lead frame part embodied from metal and fastened to the substrate, the stamped lead frame part configured to establish electrical connections between the lateral contact surfaces of the SMD component and further functional elements of the assembly,

wherein the stamped lead frame part comprises contact tongues that lie in a resilient manner against the lateral contact surfaces and are connected by a positive material connection to the lateral contact surfaces,

wherein the depression comprises a base and lateral wall faces that extend from the base towards the face,

wherein the lateral wall faces are arranged in an inclined manner in the region of the contact tongues, so that an angle in a range from 95° to 140° is produced between a lateral wall face and an adjoining portion of the face defining free space for the contact tongues.

2. The assembly as claimed in claim 1 , wherein the contact tongues protrude into the depression.

3. The assembly as claimed in claim 2 , wherein the stamped lead frame part is fastened to the face of the substrate.

4. The assembly as claimed in claim 2 , wherein the contact tongues protrude out from the face into the depression.

5. The assembly as claimed in claim 2 , wherein the contact tongues are arranged at a distance from the lateral wall faces.

6. The assembly as claimed in claim 2 , wherein at least one respective contact tongue is arranged on each of at least two sides of the depression.

7. The assembly as claimed in claim 2 , wherein the contact tongues comprise a first portion that is curved around an edge of the depression and is arranged at a distance from each of:

the edge of the depression,

a lateral wall face of the depression, and

the face of the substrate.

8. The assembly as claimed in claim 2 , wherein at least one respective contact tongue is arranged on each side of the depression.

9. The assembly as claimed in claim 1 , wherein the substrate is produced in an injection molding process.

10. The assembly as claimed in claim 9 , wherein the substrate is connected to the stamped lead frame part in the injection molding process.

11. The assembly as claimed in claim 1 , wherein the stamped lead frame part is adhered to the substrate.

12. The assembly as claimed in claim 1 , wherein the contact tongues are embodied in one piece with the stamped lead frame part by reshaping and cutting the stamped lead frame part.

13. The assembly as claimed in claim 1 , further comprising an encapsulation compound that encases the SMD component and the contact tongues.

14. The assembly as claimed in claim 1 , wherein SMD component is a ceramic condenser having four lateral contact surfaces, wherein each two lateral contact surfaces lie as a pair opposite one another.

15. The assembly as claimed in claim 1 , wherein the substrate is a housing part of an electric motor and the stamped lead frame part establishes electrical connections of the electric motor.

16. The assembly as claimed in claim 15 , wherein the housing part of the electric motor is a motor part end cap.

17. The assembly as claimed in claim 1 , wherein the further functional elements of the assembly are brush holders.

18. An assembly comprising:

a substrate embodied from an electrically insulating material;

an SMD component having lateral contact surfaces; and

a stamped lead frame part embodied from metal and fastened to the substrate, the stamped lead frame part configured to establish electrical connections between the lateral contact surfaces of the SMD component and further functional elements of the assembly,

wherein the stamped lead frame part comprises contact tongues that lie in a resilient manner against the lateral contact surfaces and are connected by a positive material connection to the lateral contact surfaces,

wherein:

the substrate comprises a depression formed in a face of the substrate,

the SMD component is arranged in the depression, and

the contact tongues protrude into the depression, and

wherein the contact tongues comprise a material thickness (d s ) that is less than a material thickness (d L ) of the stamped lead frame part in a portion that is remote from the depression.