Methods of manufacturing metal wiring buried flexible substrate and flexible substrates manufactured by the same
View Patent ↗Disclosed are a method of manufacturing a metal wiring buried flexible substrate and a flexible substrate manufactured by the same. The method includes coating a sacrificial layer including a polymer soluble in water or an organic solvent, or a photodegradable polymer on a substrate (Step 1), forming a metal wiring on the sacrificial layer in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the sacrificial layer including the metal wiring formed thereon in Step 2 and curing (Step 3) and separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3 (Step 4).
1. A method of manufacturing a metal wiring buried flexible substrate comprising:
coating a sacrificial layer including a polymer soluble in water or an organic solvent, or a photodegradable polymer on a substrate (Step 1);
forming a metal wiring on the sacrificial layer in Step 1 (Step 2);
forming a metal wiring buried polymer layer by coating a curable polymer on the sacrificial layer including the metal wiring formed thereon in Step 2 and curing (Step 3); and
separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3 (Step 4).
2. The method as set forth in claim 1 , further comprising attaching a functional flexible substrate on the curable polymer before curing the curable polymer in step 3.
3. The method as set forth in claim 2 , wherein a surface of the functional flexible substrate is coated with an ultraviolet shielding layer, a wavelength controlling layer, a light focusing layer, an anti-fouling layer or a moisture/oxygen permeation preventing layer, or is texturing treated.
4. The method as set forth in claim 1 , further comprising depositing or coating a transparent electrode on an exposed surface portion of the metal wiring of the separated polymer in step 4.
5. The method as set forth in claim 4 , wherein the transparent electrode is formed by
a metal oxide or a metal oxide-metal-metal oxide selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (MO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), fluorine tin oxide (FTO), indium tin oxide-silver-indium tin oxide (ITO-Ag-ITO)), indium zinc oxide-silver-indium zinc oxide (IZO-Ag-IZO), indium zinc tin oxide-silver-indium zinc tin oxide (IZTO-Ag-IZTO) and aluminum zinc oxide-silver-aluminum zinc oxide (AZO-Ag-AZO);
an organic conductive material of PEDOT:PSS or polyaniline (PANT);
a thin film including a silver thin film or a gold thin film;
a thin film including a silver nanowire, a gold nanowire, a copper nanowire or a platinum nanowire; or
a carbon-based material including a carbon nanotube or graphene.
6. The method as set forth in claim 1 , further comprising electroplating a metal electrode on an exposed surface portion of the metal wiring of the separated polymer layer from the substrate in step 4.
7. The method as set forth in claim 1 , further comprising coating a separating layer on the substrate before coating a sacrificial layer in step 1,
wherein the separating layer is one of a fluorine-based resin and a silicon resin.
8. The method as set forth in claim 1 , wherein the sacrificial layer is formed by coating a polymer selected from the group consisting of polyvinyl alcohol, polyethylene glycol and carboxymethyl cellulose, or a polymethyl methacrylate (PMMA), or a photosensitive polymer (photoresist, PR).
9. The method as set forth in claim 1 , wherein the metal wiring is formed by coating silver (Ag), copper (Cu), aluminum (Al), gold (Au), platinum (Pt), nickel (Ni), titanium (Ti) or an alloy thereof.
10. The method as set forth in claim 1 , wherein the metal wiring is formed by coating one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), indium tin oxide-silver-indium tin oxide (ITO-Ag-ITO), indium zinc oxide-silver-indium zinc oxide (IZO-Ag-IZO), indium zinc tin oxide-silver-indium zinc tin oxide (IZTO-Ag-IZTO) and aluminum zinc oxide-silver-aluminum zinc oxide (AZO-Ag-AZO), or a mixture thereof.
11. The method as set forth in claim 1 , wherein the metal wiring is formed by an inkjet printing, a gravure printing, a gravure offset, an aerosol printing, a screen printing, an electroplating, a vacuum deposition or a photolithography process.
12. The method as set forth in claim 1 , wherein the curable polymer is one selected from the group consisting of polyethylene terephthalate (PET), polyethylene sulfone (PES), polyethylene naphthalate (PEN), polycarbonate (PC), polymethyl methacrylate (PMMA), polyimide (PI), ethylene vinyl acetate (EVA), amorphous polyethylene terephthalate (APET), polypropylene terephthalate (PPT), polyethylene terephthalate glycerol (PETG), polycyclohexylene dimethylene terephthalate (PCTG), modified triacetyl cellulose (TAC), cycloolefin polymer (COP), cycloolefin copolymer (COC), dicyclopentadiene polymer (DCPD), cyclopentadiene polymer (CPD), polyarylate (PAR), polyether imide (PEI), polydimethyl siloxane (PDMS), a silicon resin, a fluorine resin and a modified epoxy resin.
13. The method as set forth in claim 1 , wherein the curing is a thermal curing, an ultraviolet curing, a moisture curing, a dry curing, a chemical reaction curing, a microwave curing, an infrared (IR) curing or a cooling curing.