IP Library Granted Patent US 9,270,322
Granted Patent B2
US 9,270,322 · App. 14/006,997 · Granted Feb 23, 2016

Printed circuit board and diplexer circuit

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Quick Facts
Patent No.
US 9,270,322
App. No.
14/006,997
Granted
Feb 23, 2016
Kind
B2
Abstract

A printed circuit board 100 for forming a diplexer circuit 200 comprising a first connector 110 for connecting a first filter 112 and second connector 120 for connecting a second filter 122 , wherein the first connector 110 and the second connector 120 are located on opposite sides of the printed circuit board 100.

Claims (26)

1. A printed circuit board for forming a diplexer circuit comprising:

a first connector for connecting a first filter and a second connector for connecting a second filter,

wherein the first connector and the second connector are located on opposite sides of the printed circuit board,

wherein the printed circuit board further comprises two layers of a non-conductive substrate and two isolated conductive layers between the two non-conductive substrate layers, the two isolated conductive layers being separated by an isolating layer,

wherein the two isolated conductive layers are parallel and forming a wave guide structure, which is configured to a quarter of the wavelength of a center frequency based on a transmission band determined by the first filter and a reception band determined by the second filter,

wherein the first filter is electrically connected to the first connector for filtering a transmit signal in the transmission band, and the second filter is electrically connected to the second connector for filtering a receive signal in the reception band,

wherein the wave guide structure is located between the first and second filters,

wherein the two conductive layers form a projection or shielding around the first connector and the second connector,

wherein the two conductive layers are connected through a further connector or a via underneath the first and second connectors,

wherein the projection or shielding extends at least a quarter of the wavelength of the center frequency from the further connector or via.

2. The printed circuit board of claim 1 , wherein the first connector corresponds to a first solder-patch and the second connector corresponds to a second solder patch.

3. The printed circuit board of claim 1 comprising at least one first connection or first via between the first connector and the conductive layers, and/or comprising at least one second connection or second via between the second connector and the conductive layer.

4. The printed circuit board of claim 1 , wherein the conductive layers have a connector for grounding the conductive layers.

5. The printed circuit board of claim 1 , wherein the wave guide structure is configured to guide an electromagnetic wave for at least a quarter of a wavelength of the electromagnetic wave.

6. A method for manufacturing a printed circuit board for forming a diplexer circuit comprising:

forming a wave guide structure in the printed circuit board comprising two non-conductive substrate layers and two isolated conductive layers between the two non-conductive substrate layers, the two isolated conductive layers being separated by an isolating layer, wherein the two isolated conductive layers are parallel and wherein the wave guide structure is configured to a quarter of the wavelength of a center frequency based on a transmission band determined by the first filter and a reception band determined by the second filter;

implementing a first connector for connecting a first filter on a first side of the printed circuit board; and

implementing a second connector for connecting a second filter on a second side of the printed circuit board, wherein the first side and the second side are located on opposite sides of the printed circuit board;

wherein the wave guide structure is located between the first and second connectors,

wherein the conductive layers form a projection or shielding around the first connector and the second connector,

wherein the conductive layers are connected through a further connector or a via underneath the first and second connectors,

wherein the projection or shielding extends at least a quarter of the wavelength of the center frequency from the further connector or via.

7. A diplexer circuit comprising the circuit board of claim 1 , a first filter connected to the first connector for filtering a transmit signal in a transmission band, and a second filter connected to the second connector for filtering a receive signal in a reception band.

8. The diplexer circuit of claim 7 , wherein the first and the second filters are further connected to an antenna using a first feed-line and a second feed-line, wherein the first feed-line and the second feed-line are located in parallel to the printed circuit board, or wherein the first and the second filter are connected to the antenna using a common antenna port and wherein the printed circuit board comprises a feed connector or via for connecting the first and the second filter to the common antenna port.

9. A method for manufacturing a diplexer, comprising manufacturing a printed circuit board for forming a diplexer circuit according to claim 6 ; mounting a first filter on the first connector; and

mounting a second filter on the second connector of the printed circuit board.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Jun 3, 2021
From: TERRIER SSC, LLC
To: WSOU INVESTMENTS, LLC
Reel/Frame 056526/0093 →
SECURITY INTEREST Recorded Jun 1, 2021
From: WSOU INVESTMENTS, LLC
To: OT WSOU TERRIER HOLDINGS, LLC
Reel/Frame 056990/0081 →
RELEASE OF SECURITY INTEREST Recorded May 21, 2019
From: OCO OPPORTUNITIES MASTER FUND, L.P. (F/K/A OMEGA CREDIT OPPORTUNITIES MASTER FUND LP
To: WSOU INVESTMENTS, LLC
Reel/Frame 049246/0405 →
SECURITY INTEREST Recorded May 20, 2019
From: WSOU INVESTMENTS, LLC
To: BP FUNDING TRUST, SERIES SPL-VI
Reel/Frame 049235/0068 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2017
From: ALCATEL LUCENT
To: WSOU INVESTMENTS, LLC
Reel/Frame 044000/0053 →
SECURITY INTEREST Recorded Sep 21, 2017
From: WSOU INVESTMENTS, LLC
To: OMEGA CREDIT OPPORTUNITIES MASTER FUND, LP
Reel/Frame 043966/0574 →
RELEASE OF SECURITY INTEREST Recorded Aug 25, 2014
From: CREDIT SUISSE AG
To: ALCATEL LUCENT
Reel/Frame 033597/0001 →
SECURITY AGREEMENT Recorded Nov 8, 2013
From: ALCATEL LUCENT
To: CREDIT SUISSE AG
Reel/Frame 031599/0962 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2013
From: PIVIT, FLORIAN
To: ALCATEL LUCENT
Reel/Frame 031264/0585 →