Method of manufacturing mounting substrate

1. A mounting substrate manufacturing method for manufacturing a mounting substrate by sequentially mounting a plurality of electronic components on a substrate by a component mounting line in which a plurality of component mounting devices that extract the electronic components from a component supply unit on which a plurality of part feeders are loaded, and mount the electronic components on the substrate are coupled to each other, the mounting substrate manufacturing method comprising:

a component set history information storing step of storing identification information on the electronic components supplied by the part feeders, loading positions of the part feeders, and a component set timing at which the electronic components are set in the part feeders linked with each other as component set history information, for each of the part feeders loaded in the component supply unit in a component mounting process intended for one substrate type;

a checking history information storing step of detecting identification information on the electronic components, and checking the identification information against production data to determine whether the electronic components are regular electronic components to be supplied from the part feeders loaded at the loading positions, or not, and storing the identification information on the electronic components, the loading positions, and the checking timing at which the checking is executed on the part feeders linked with each other as the checking history information if it is determined that the electronic component is the regular electronic component, for each of the part feeders loaded in the component supply unit at a preset given timing in the component mounting process; and

an error coping step which is executed when it is determined that the electronic component is a different type of component which is not the regular electronic component to be supplied from the part feeder loaded at the loading position, at the preset given timing,

wherein the error coping step includes:

a first device stopping step of stopping production operation of the component mounting device in which the part feeders in which the different type of components is set is loaded;

a timing specifying step of specifying the component set timing at which the different type of component is set, on the basis of the component set history information;

a substrate specifying step of specifying all of the substrates to be target of production by the component mounting device after the specified component set timing as substrates to be managed on which the different type of component is potentially mounted; and

a second device stop step of stopping the production operation of all the component mounting devices which are arranged downstream of the component mounting device, and which are intended to produce with the substrates to be managed.

2. The mounting substrate manufacturing method according to claim 1 ,

wherein in the error coping step, information on the substrates to be managed is notified to downstream processes.

3. The mounting substrate manufacturing method according to claim 1 ,

wherein the given timing is defined by a predetermined interval.

4. The mounting substrate manufacturing method according to claim 1 ,

wherein the part feeders are tape feeders that supply the electronic components by pitch-feeding carrier tapes which retain the electronic components, and

wherein the given timing is a reel replacement time when replacing a supply reel that winds up the carrier tapes in the tape feeder with others, or a tape splicing execution time when joining the existing carrier tapes to new carrier tapes.

5. The mounting substrate manufacturing method according to claim 1 ,

wherein the substrates to be managed are specified by substrate identification code of the substrate to be target of production by the component mounting device after the specified component set timing.

6. The mounting substrate manufacturing method according to claim 1 ,

wherein the substrates to be managed are specified by the number of substrates to be target of production by the component mounting device after the specified component set timing.