Semiconductor chip, display comprising a plurality of semiconductor chips and methods for the production thereof
View Patent ↗An optoelectronic semiconductor chip including a semiconductor body of semiconductor material, an outcoupling face arranged downstream of the semiconductor body in an emission direction and a mirror layer, wherein the semiconductor body includes an active layer that generates radiation, the mirror layer is arranged on the side of the semiconductor body remote from the outcoupling face, and a gap between the active layer and the mirror layer is set such that radiation emitted by the active layer towards the outcoupling face interferes with radiation reflected at the mirror layer such that the semiconductor chip features an emitted radiation pattern with a selected direction in the forward direction.
1. An optoelectronic semiconductor chip comprising a semiconductor body of semiconductor material, an outcoupling face arranged downstream of the semiconductor body in an emission direction and a mirror layer, wherein
the semiconductor body comprises an active layer that generates radiation,
the mirror layer is arranged on the side of the semiconductor body remote from the outcoupling face,
a gap between the active layer and the mirror layer is set such that radiation emitted by the active layer towards the outcoupling face interferes with radiation reflected at the mirror layer such that the semiconductor chip features an emitted radiation pattern with a selected direction in the emission direction, and
Formula (1) is satisfied:
p 2 =p 1 *( d 1 −d 3 )*tan( a sin( n 2 /n 1 ))+ d 2 *tan(α 2 ) (1)
wherein p 1 is a half value of the energized active layer, p 2 is a half value of the outcoupling face, d 1 is the height of the semiconductor body, d 2 is the height of the potting material, d 3 is a gap between the active layer and the mirror layer, n 1 is a refractive index of the semiconductor material and n 2 is a refractive index of the potting material, with 0≦α 2 <90°.
2. The semiconductor chip according to claim 1 , wherein the outcoupling face has a lateral extent which is less than a lateral extent of the semiconductor body, and the gap between the active layer and the mirror layer is 90 nm, with a tolerance of at most 10%.
3. The semiconductor chip according to claim 1 , further comprising a potting material arranged on the semiconductor body which has a refractive index less than the refractive index of the semiconductor material.
4. The semiconductor chip according to claim 1 , further comprising a Bragg mirror arranged between the active layer and the outcoupling face.
5. The semiconductor chip according to claim 4 , wherein the Bragg mirror comprises Al x Ga (1-x) N and GaN layers.
6. The semiconductor chip according to claim 3 , further comprising a conversion layer applied to the side of the potting material remote from the semiconductor body or to the semiconductor body.
7. A display comprising a plurality of the optoelectronic semiconductor chips according to claim 1 , laterally arranged next to one another.
8. The display according to claim 7 , wherein the plurality of semiconductor chips comprises a common semiconductor body.
9. The display according to claim 8 , wherein regions of the active layer energized in operation and the outcoupling faces of neighboring semiconductor chips are arranged at a lateral distance from one another.
10. The display according to claim 7 , wherein a potting material is arranged on the semiconductor bodies of the semiconductor chips, the potting material has a refractive index less than the refractive index of the semiconductor material, and a recess filled with gas is arranged between the potting materials of neighboring semiconductor chips.
11. The display according to claim 7 , wherein a potting material is arranged on the semiconductor bodies of the semiconductor chips, the potting material has a refractive index less than the refractive index of the semiconductor material, and an absorber layer is arranged on a side of the active layer remote from the potting material between the regions of the active layer of neighboring semiconductor chips energized in operation.
12. The display according to claim 7 , wherein a potting material is arranged on the semiconductor bodies of the semiconductor chips, the potting material has a refractive index less than the refractive index of the semiconductor material, and a conversion layer is applied to the side of the potting material remote from the semiconductor body, the conversion layer comprises a plurality of regions that convert radiation emitted by the active layer into radiation of a different wavelength.
13. An optoelectronic semiconductor chip comprising a semiconductor body of semiconductor material, an outcoupling face arranged downstream of the semiconductor body in an emission direction and a mirror layer, wherein
the semiconductor body comprises an active layer that generates radiation,
the mirror layer is arranged on the side of the semiconductor body remote from the outcoupling face,
a gap between the active layer and the mirror layer is set such that radiation emitted by the active layer towards the outcoupling face interferes with radiation reflected at the mirror layer such that the semiconductor chip features an emitted radiation pattern with a selected direction in the emission direction, and
Formula (1) is satisfied:
p 2 =p 1 +( d 1 −d 3 )*tan( a sin( n 2 /n 1 ))+ d 2 *tan(α 2 ) (1)
wherein p 1 is a half value of the energized active layer, p 2 is a half value of the outcoupling face, d 1 is the height of the semiconductor body, d 2 is the height of the potting material, d 3 is a gap between the active layer and the mirror layer, n 1 is a refractive index of the semiconductor material and n 2 is a refractive index of the potting material, with 0≦α 2 <90°.