Imprinted bi-layer micro-structure method

1. A method of making a micro-wire structure, comprising:

providing a substrate having an edge area and a central area separate from the edge area;

providing first, second, and third different stamps;

providing a curable bottom layer in relation to the substrate;

forming an imprinted bottom-layer micro-channel in the curable bottom layer by at least imprinting the curable bottom layer with the first stamp in at least a portion of the central area and in at least a portion of the edge area and curing the curable bottom layer, the bottom-layer micro-channel extending from the central area into the edge area;

locating a curable electrical conductor in the bottom-layer micro-channel and curing the curable electrical conductor to form a bottom-layer micro-wire in the bottom-layer micro-channel, the bottom-layer micro-wire extending from the central area into the edge area;

providing a curable connecting layer adjacent to and in contact with the cured bottom layer and the bottom-layer micro-wire;

forming an imprinted connecting-layer micro-channel in the curable connecting layer by at least imprinting the curable connecting layer with the second stamp over at least a portion of the bottom-layer micro-channel in at least a portion of the edge area and curing the curable connecting layer;

forming a connecting-layer micro-wire in the connecting-layer micro-channel contacting at least a portion of the bottom-layer micro-wire;

providing a curable top layer adjacent to and in contact with the cured connecting layer and the connecting-layer micro-wire;

forming an imprinted edge micro-channel in the curable top layer by at least imprinting the curable top layer with the third stamp over at least a portion of the connecting-layer micro-channel in at least a portion of the edge area and forming an imprinted top-layer micro-channel in the curable top layer by at least imprinting the curable top layer with the third stamp separate from the bottom-layer micro-channel and over at least a portion of the bottom-layer micro-channel in at least a portion of the central area and curing the curable top layer;

forming an edge micro-wire in the edge micro-channel contacting at least a portion of the connecting-layer micro-wire and forming a top-layer micro-wire in the top-layer micro-channel that is electrically isolated from the edge micro-wire, the connecting-layer micro-wire, and the bottom-layer micro-wire; and

wherein the bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire.

2. The method of claim 1 , wherein the substrate has at least one edge and the edge area is adjacent to the edge.

3. The method of claim 1 , wherein the step of forming the imprinted connecting-layer micro-channel further includes contacting the bottom-layer micro-wire with the second stamp.

4. The method of claim 1 , wherein the step of forming the imprinted edge micro-channel further includes contacting the connecting-layer micro-wire with the third stamp.

5. The method of claim 1 , wherein the bottom and connecting layers include cross-linkable material and further including cross linking the cross-linkable first-layer material to the cross-linkable second-layer material or wherein the connecting and top layers include cross-linkable material and further including cross linking the cross-linkable second-layer material to the cross-linkable third-layer material.

6. The method of claim 1 , wherein a portion of the edge micro-wire forms at least a portion of a connection pad.

7. The method of claim 6 , wherein the connection pad further includes a plurality of micro-wires.

8. The method of claim 1 , further including forming a plurality of edge micro-wires electrically connected through a corresponding plurality of connection micro-wires to a corresponding plurality of bottom-layer micro-wires.

9. The method of claim 8 , further including forming a plurality of top-layer micro-wires electrically isolated from the edge micro-wires.

10. The method of claim 1 , further including removing a portion of the cured connecting layer or removing a portion of the cured top layer.

11. The method of claim 10 , further including removing the portion of the cured second or cured top layer by treating the cured second or cured top layer with a plasma treatment.

12. The method of claim 10 , further including thinning the cured second or cured top layer by a thinning depth.

13. The method of claim 12 , wherein the thinning depth is less than the difference between the depth of the cured second or cured top layer and the depth of any micro-channels in the corresponding cured second or cured top layer.

14. A method of making a micro-wire structure, comprising:

providing a substrate having an edge area and a central area separate from the edge area;

providing first, second, and third different stamps;

providing a curable bottom layer in relation to the substrate;

forming an imprinted bottom-layer micro-channel in the curable bottom layer by at least imprinting the curable bottom layer with the first stamp in at least a portion of the central area and in at least a portion of the edge area and curing the curable bottom layer, the bottom-layer micro-channel extending from the central area into the edge area;

locating a curable electrical conductor in the bottom-layer micro-channel and curing the curable electrical conductor to form a bottom-layer micro-wire in the bottom-layer micro-channel, the bottom-layer micro-wire extending from the central area into the edge area;

providing a curable connecting layer adjacent to and in contact with the cured bottom layer and the bottom-layer micro-wire;

forming an imprinted connecting-layer micro-channel in the curable connecting layer by at least imprinting the curable connecting layer with the second stamp over at least a portion of the bottom-layer micro-channel in at least a portion of the edge area and curing the curable connecting layer;

forming a connecting-layer micro-wire in the connecting-layer micro-channel contacting at least a portion of the bottom-layer micro-wire;

providing a curable top layer adjacent to and in contact with the cured connecting layer and the connecting-layer micro-wire;

forming an imprinted edge micro-channel in the curable top layer by at least imprinting the curable top layer with the third stamp over at least a portion of the connecting-layer micro-channel in at least a portion of the edge area and forming an imprinted top-layer micro-channel in the curable top layer by at least imprinting the curable top layer with the third stamp separate from the bottom-layer micro-channel and over at least a portion of the bottom-layer micro-channel in at least a portion of the central area and curing the curable top layer;

forming an edge micro-wire in the edge micro-channel contacting at least a portion of the connecting-layer micro-wire and forming a top-layer micro-wire in the top-layer micro-channel that is electrically isolated from the edge micro-wire, the connecting-layer micro-wire, and the bottom-layer micro-wire;

forming a plurality of edge micro-wires electrically connected through a corresponding plurality of connection micro-wires to a corresponding plurality of bottom-layer micro-wires;

forming a plurality of top-layer micro-wires electrically isolated from the edge micro-wires;

wherein the bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire; and

wherein the top-layer micro-wires and the bottom-layer micro-wires form a two-dimensional array of overlapping micro-wires.

15. A method of making a micro-wire structure, comprising:

providing a substrate having an edge area and a central area separate from the edge area;

providing first, second, and third different stamps;

providing a curable bottom layer in relation to the substrate;

forming an imprinted bottom-layer micro-channel in the curable bottom layer by at least imprinting the curable bottom layer with the first stamp in at least a portion of the central area and in at least a portion of the edge area and curing the curable bottom layer, the bottom-layer micro-channel extending from the central area into the edge area;

locating a curable electrical conductor in the bottom-layer micro-channel and curing the curable electrical conductor to form a bottom-layer micro-wire in the bottom-layer micro-channel, the bottom-layer micro-wire extending from the central area into the edge area;

providing a curable connecting layer adjacent to and in contact with the cured bottom layer and the bottom-layer micro-wire;

forming an imprinted connecting-layer micro-channel in the curable connecting layer by at least imprinting the curable connecting layer with the second stamp over at least a portion of the bottom-layer micro-channel in at least a portion of the edge area and curing the curable connecting layer;

forming a connecting-layer micro-wire in the connecting-layer micro-channel contacting at least a portion of the bottom-layer micro-wire;

providing a curable top layer adjacent to and in contact with the cured connecting layer and the connecting-layer micro-wire;

forming an imprinted edge micro-channel in the curable top layer by at least imprinting the curable top layer with the third stamp over at least a portion of the connecting-layer micro-channel in at least a portion of the edge area and forming an imprinted top-layer micro-channel in the curable top layer by at least imprinting the curable top layer with the third stamp separate from the bottom-layer micro-channel and over at least a portion of the bottom-layer micro-channel in at least a portion of the central area and curing the curable top layer;

forming an edge micro-wire in the edge micro-channel contacting at least a portion of the connecting-layer micro-wire and forming a top-layer micro-wire in the top-layer micro-channel that is electrically isolated from the edge micro-wire, the connecting-layer micro-wire, and the bottom-layer micro-wire;

forming a plurality of edge micro-wires electrically connected through a corresponding plurality of connection micro-wires to a corresponding plurality of bottom-layer micro-wires;

forming a plurality of top-layer micro-wires electrically isolated from the edge micro-wires;

wherein the bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire; and

wherein the substrate has at least first and second edges and at least some of the plurality of edge micro-wires are located in an edge area adjacent to the first edge and at least some of the plurality of top-layer micro-wires extend into a second edge area adjacent to the second edge and separate from the central area.

16. The method of claim 15 , wherein the edge micro-wires are in the edge area and the top-layer micro-wires extend into the edge area.

17. The method of claim 16 , wherein portions of the top-layer micro-wires are interdigitated between the edge micro-wires in the edge area.

18. A method of making a micro-wire structure, comprising:

providing a substrate having an edge area and a central area separate from the edge area;

providing first, second, and third different stamps;

providing a curable bottom layer in relation to the substrate;

forming an imprinted bottom-layer micro-channel in the curable bottom layer by at least imprinting the curable bottom layer with the first stamp in at least a portion of the central area and in at least a portion of the edge area and curing the curable bottom layer, the bottom-layer micro-channel extending from the central area into the edge area;

locating a curable electrical conductor in the bottom-layer micro-channel and curing the curable electrical conductor to form a bottom-layer micro-wire in the bottom-layer micro-channel, the bottom-layer micro-wire extending from the central area into the edge area;

providing a curable connecting layer adjacent to and in contact with the cured bottom layer and the bottom-layer micro-wire;

forming an imprinted connecting-layer micro-channel in the curable connecting layer by at least imprinting the curable connecting layer with the second stamp over at least a portion of the bottom-layer micro-channel in at least a portion of the edge area and curing the curable connecting layer;

forming a connecting-layer micro-wire in the connecting-layer micro-channel contacting at least a portion of the bottom-layer micro-wire;

providing a curable top layer adjacent to and in contact with the cured connecting layer and the connecting-layer micro-wire;

forming an imprinted edge micro-channel in the curable top layer by at least imprinting the curable top layer with the third stamp over at least a portion of the connecting-layer micro-channel in at least a portion of the edge area and forming an imprinted top-layer micro-channel in the curable top layer by at least imprinting the curable top layer with the third stamp separate from the bottom-layer micro-channel and over at least a portion of the bottom-layer micro-channel in at least a portion of the central area and curing the curable top layer;

forming an edge micro-wire in the edge micro-channel contacting at least a portion of the connecting-layer micro-wire and forming a top-layer micro-wire in the top-layer micro-channel that is electrically isolated from the edge micro-wire, the connecting-layer micro-wire, and the bottom-layer micro-wire;

wherein the bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire; and

wherein either:

a) the curable bottom layer includes first curable material and further including locating the first stamp in contact with the first curable material and only partially curing the first curable material, wherein the curable connecting layer includes second curable material and further including locating the second stamp in contact with the second curable material, and at least partially curing both the first curable material and the second curable material in a common step; or

b) the curable connecting layer includes second curable material and further including locating the second stamp in contact with the second curable material and only partially curing the second curable material, wherein the curable top layer includes third curable material and further including locating the third stamp in contact with the third curable material, and at least partially curing both the second curable material and the third curable material in a common step.

19. A method of making a micro-wire structure, comprising:

providing a substrate having an edge area and a central area separate from the edge area;

providing first, second, and third different stamps;

providing a curable bottom layer in relation to the substrate;

forming an imprinted bottom-layer micro-channel in the curable bottom layer by at least imprinting the curable bottom layer with the first stamp in at least a portion of the central area and in at least a portion of the edge area and curing the curable bottom layer, the bottom-layer micro-channel extending from the central area into the edge area;

locating a curable electrical conductor in the bottom-layer micro-channel and curing the curable electrical conductor to form a bottom-layer micro-wire in the bottom-layer micro-channel, the bottom-layer micro-wire extending from the central area into the edge area;

providing a curable connecting layer adjacent to and in contact with the cured bottom layer and the bottom-layer micro-wire;

forming an imprinted connecting-layer micro-channel in the curable connecting layer by at least imprinting the curable connecting layer with the second stamp over at least a portion of the bottom-layer micro-channel in at least a portion of the edge area and curing the curable connecting layer;

forming a connecting-layer micro-wire in the connecting-layer micro-channel contacting at least a portion of the bottom-layer micro-wire;

providing a curable top layer adjacent to and in contact with the cured connecting layer and the connecting-layer micro-wire;

forming an imprinted edge micro-channel in the curable top layer by at least imprinting the curable top layer with the third stamp over at least a portion of the connecting-layer micro-channel in at least a portion of the edge area and forming an imprinted top-layer micro-channel in the curable top layer by at least imprinting the curable top layer with the third stamp separate from the bottom-layer micro-channel and over at least a portion of the bottom-layer micro-channel in at least a portion of the central area and curing the curable top layer;

forming an edge micro-wire in the edge micro-channel contacting at least a portion of the connecting-layer micro-wire and forming a top-layer micro-wire in the top-layer micro-channel that is electrically isolated from the edge micro-wire, the connecting-layer micro-wire, and the bottom-layer micro-wire; and

wherein the bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire; and either:

a) depositing first conductive ink in the bottom-layer micro-channel and at least partially curing the first conductive ink, further including depositing second conductive ink in the connecting-layer micro-channel and at least partially curing the first conductive and second conductive ink in a common step; or

b) depositing first conductive ink in the connecting-layer micro-channel and at least partially curing the first conductive ink, further including depositing second conductive ink in the edge micro-channel and at least partially curing the first conductive and second conductive ink in a common step.

20. The method of claim 19 , wherein the first and second conductive inks include electrically conductive particles and further including sintering, welding, or agglomerating electrically conductive particles in the second conductive ink to electrically conductive particles in the first conductive ink.