Electronic and optical co-packaging of coherent transceiver
View Patent ↗Disclosed herein are co-packaging structures, devices, and methods for integrating a photonic integrated circuit (PIC), an electronic integrated circuit including drivers and transimpedance amplifiers (TIAs) and an ASIC having analog-to-digital converters and a digital signal processor positioned on a common (the same) carrier thereby resulting in a compact coherent transceiver while lowering its cost.
1. A co-packaged electronic and optical apparatus comprising:
a package substrate body;
a chip comprising a driver and/or transimpedance amplifier (TIA), the chip being attached to the package substrate body;
an application specific integrated circuit (ASIC) attached to and in electrical communication with the chip;
a photonic integrated circuit (PIC) adjacent to and in electrical communication with the chip, the PIC having a surface;
a single-piece mast positioned adjacent to the PIC; and
an optical fiber coiled around the single-piece mast and having an end terminating substantially perpendicularly on the surface of the PIC.
2. The co-packaged electronic and optical apparatus of claim 1 , wherein the PIC and the ASIC are mechanically and electrically connected to the chip and a top surface of the package substrate body through the effect of ball grid array (BGA) structures.
3. The co-packaged electronic and optical apparatus of claim 2 , wherein a bottom surface of the package substrate body includes BGA structures.
4. The co-packaged electronic and optical apparatus of claim 2 , wherein the PIC includes a number of through silicon vias (TSVs) formed therein.
5. An apparatus comprising the co-packaged electronic and optical apparatus of claim 2 in combination with a laser source, wherein the PIC is optically connected to the laser source via the optical fiber.
6. A co-packaged apparatus comprising:
a package substrate body;
an interposer adjacent to and in electrical communication with the package substrate body through the effect of a ball grid array (BGA);
a chip comprising a driver and/or transimpedance amplifier (TIA), the chip being adjacent to and in electrical communication with the interposer through the effect of a BGA;
an application specific integrated circuit chip (ASIC) adjacent to and in electrical communication with the interposer through the effect of a BGA;
a photonic integrated circuit (PIC) adjacent to and in electrical communication with the interposer through the effect of a BGA, wherein said interposer electrically interconnects the PIC to the chip and electrically interconnects the ASIC to the chip;
a mast positioned adjacent to the PIC; and
an optical fiber secured to the mast so that an end of the optical fiber is approximately normal to a surface of the PIC.
7. The co-packaged apparatus of claim 6 wherein a bottom surface of the package substrate body includes BGA structures.
8. The co-packaged apparatus of claim 7 , wherein the PIC includes a number of through silicon vias (TSVs) formed therein.
9. An apparatus comprising the co-packaged apparatus of claim 6 optically connected to a laser source via the optical fiber.
10. The apparatus of claim 5 , wherein the apparatus comprises an optical coherent transceiver of which the laser source and the co-packaged electronic and optical apparatus form a part.
11. The co-packaged electronic and optical apparatus of claim 1 , wherein the surface is a surface of a recess in the PIC, and wherein an optical fiber assembly is mounted in the recess.
12. The co-packaged electronic and optical apparatus of claim 11 , wherein the PIC is flip-chip mounted on the package substrate body.
13. The co-packaged electronic and optical apparatus of claim 12 , wherein the PIC further includes a mirror.
14. The co-packaged electronic and optical apparatus of claim 1 , wherein the chip is mounted in a recess of the package substrate body.
15. The co-packaged electronic and optical apparatus of claim 1 , wherein the surface is a backside surface of the PIC.
16. The apparatus of claim 9 , wherein the apparatus comprises an optical coherent transceiver of which the laser source and the co-packaged apparatus form a part.
17. The co-packaged apparatus of claim 6 , wherein the PIC includes an etched recess in which an optical fiber assembly is mounted to optically couple the optical fiber to the PIC.
18. The co-packaged apparatus of claim 6 , wherein the mast is mounted on the interposer.