U form-factor intelligent electronic device (IED) hardware platform with matching of IED wiring, from a non U form-factor IED hardware platform using adapter structure
View Patent ↗A method and apparatus provides an Intelligent Electronic Device (IED) with new hardware modules. Hardware modules are provided that are configured for electrically connecting with connections of a first IED housing that has a first form factor. A second IED housing is provided having a second form factor that is different from the first form factor. The hardware modules are mounted in the second housing. Adaptor structure is employed to electrically connect the hardware modules with connections of the second housing. The second housing is mounted into an existing wiring and second form factor environment.
1. A method of providing an Intelligent Electronic Device (IED) with new hardware modules, the method comprising:
providing hardware modules configured for directly electrically connecting with connections of a first IED housing that has a first form factor,
providing a second IED housing having a second form factor that is different from the first form factor,
mounting the hardware modules in the second housing, and
employing adaptor structure to electrically connect the hardware modules with connections of the second housing,
wherein the step of providing hardware modules includes providing a Power Supply Module (PSM) and a Binary Input/Output (BIO) module, and the step of employing the adaptor structure includes electrically connecting a first adaptor structure between the PSM module and the BIO module, and connectors at a back panel of the second housing,
wherein the method further comprises the steps of:
providing a communication (COM) card having communication ports accessible at a back panel of the second housing, and
employing a second adaptor structure electrically connected between the COM card and a connector of a backplane adjacent to a front panel of the second housing.
2. The method of claim 1 , wherein the step of employing adaptor structure includes employing at least one printed circuit board.
3. The method of claim 1 , wherein the first form factor is defined by the first housing having a height of 6.97″, width of 6.97″ and depth of 7.91″ and the second form factor is defined by the second housing having a height of 5.22″, width of 17.12″ and depth of 9.00″.
4. The method of claim 3 , wherein the step of providing the hardware modules incudes providing the hardware modules that are suitable for mounting the hardware modules in the first IED housing, and wherein the mounting step includes mounting the hardware modules in the second housing in a horizontally adjacent manner.
5. An Intelligent Electronic Device (IED) comprising:
a plurality of hardware modules configured for directly electrically connecting with connections of a first IED housing that has a first form factor,
a second IED housing having a second form factor that is different from the first form factor, the hardware modules being mounted within the second housing, and
adaptor structure constructed and arranged to electrically connect the hardware modules with connections of the second housing,
wherein the hardware modules include a Power Supply Module (PSM) and a Binary Input/Output (BIO) module, and the adaptor structure includes a first adaptor structure electrically connected between the PSM module and the BIO module and connectors at a back panel of the second housing,
wherein the PSM and the BIO module are mounted on a tray coupled to a front panel, the front panel being coupled to an open end of the second housing,
wherein the device further comprises:
a communication (COM) card having communication ports accessible at a back panel of the second housing, and
a second adaptor structure electrically connected between the COM card and a connector of a backplane adjacent to the front panel.
6. The device of claim 5 , wherein the adaptor structure includes at least one printed circuit board.
7. The device of claim 5 , wherein the PSM and the BIO module are mounted on the tray in an adjacent horizontal manner.
8. The device of claim 5 , wherein the first adaptor structure includes a first printed circuit board.
9. The device of claim 5 , wherein the second adaptor structure includes a second printed circuit board.
10. The device of claim 5 , wherein the first form factor is defined by the first housing having a height of 6.97″, width of 6.97″ and depth of 7.91″ and the second form factor is defined by the second housing having a height of 5.22″, width of 17.12″ and depth of 9.00″.
11. The device of claim 5 , wherein the second IED housing is constructed and arranged so that the hardware modules are mounted in a horizontally adjacent manner therein.