Electronic apparatus
View Patent ↗According to one embodiment, an electronic apparatus includes a heating component, a housing, and a heat pipe. The housing accommodates the heating component and includes a wall. The wall includes a first region configured to receive heat from the component and a second region configured to have a lower temperature than a temperature of the first region. At least a portion of the heat pipe is buried in the wall from the first region to the second region.
1. An electronic apparatus comprising:
a heating component;
a housing comprising a wall, the heating component in the housing, the wall comprising a first region that receives heat from the heating component and a second region that has a lower temperature than a temperature of the first region;
a heat pipe, at least a portion of the heat pipe in the wall between the first region and the second region; and
a heat insulator between the heating component and the first region.
2. The electronic apparatus of claim 1 ,
wherein an inner surface of the wall comprises a groove, and
at least a portion of the heat pipe is in the groove.
3. The electronic apparatus of claim 1 ,
wherein a transversal thickness of the heat pipe is less than a transversal thickness of the wall.
4. The electronic apparatus of claim 2 ,
wherein
a surface of the heat pipe is substantially flush with the inner surface of the wall.
5. The electronic apparatus of claim 1 , further comprising:
a fan in the housing,
wherein the second region comprises a hole that directs air flow toward the fan for cooling the second region.
6. The electronic apparatus of claim 1 , further comprising:
a heat diffuser having a greater transversal width than a transversal width of the heat pipe, the heat diffuser on an inner surface of the wall in the first region.
7. The electronic apparatus of claim 1 , further comprising:
a heat diffuser having a greater transversal width than a transversal width of the heat pipe, the heat diffuser on an inner surface of the wall in the second region.
8. The electronic apparatus of claim 1 ,
wherein the heat pipe is inside the wall.