IP Library Granted Patent US 9,054,241
Granted Patent B2
US 9,054,241 · App. 14/015,041 · Granted Jun 9, 2015

Back contact electrodes for cadmium telluride photovoltaic cells

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Quick Facts
Patent No.
US 9,054,241
App. No.
14/015,041
Granted
Jun 9, 2015
Kind
B2
Abstract

A method for forming a back contact for a photovoltaic cell that includes at least one semiconductor layer is provided. The method includes applying a continuous film of a chemically active material on a surface of the semiconductor layer and activating the chemically active material such that the activated material etches the surface of the semiconductor layer. The method further includes removing the continuous film of the activated material from the photovoltaic cell and depositing a metal contact layer on the etched surface of the semiconductor layer.

Claims (26)

1. A photovoltaic cell, comprising:

a semiconductor layer comprising cadmium telluride and defining an etched surface, wherein the etched surface of the semiconductor layer has a tellurium to cadmium ratio that is greater than about 2; and

a metal contact layer deposited directly onto the etched surface;

wherein the semiconductor layer has a tellurium to cadmium ratio that is highest at the surface and tapers off while moving deeper inside the semiconductor layer such that the tellurium to cadmium ratio is 1 at a certain depth within the semiconductor layer.

2. The photovoltaic cell as in claim 1 , wherein the etched surface of the semiconductor layer has a tellurium to cadmium ratio that is greater than 3.

3. The photovoltaic cell as in claim 1 , wherein the etched surface of the semiconductor layer has a tellurium to cadmium ratio that is greater than 5.

4. The photovoltaic cell as in claim 1 , wherein the metal contact layer comprises a metal selected from the group consisting of molybdenum, tantalum, tungsten, alloys of molybdenum, tantalum, titanium or tungsten, compounds comprising molybdenum or tungsten, and combinations thereof.

5. The photovoltaic cell as in claim 1 , wherein the metal contact layer has a thickness of less than or equal to 100 nm.

6. The photovoltaic cell as in claim 1 , further comprising:

a second metal contact layer deposited onto the metal contact layer.

7. The photovoltaic cell as in claim 6 , wherein the metal layer comprises molybdenum, and the second metal layer comprises aluminum.

8. The photovoltaic cell as in claim 7 , wherein the second metal layer has a thickness of 50-1000 nm.

9. The photovoltaic cell as in claim 7 , further comprising:

a third metal layer deposited on the second metal contact layer.

10. The photovoltaic cell as in claim 9 , wherein the third metal layer comprises nickel.

11. The photovoltaic cell as in claim 9 , wherein the third metal layer comprises chromium.

12. The photovoltaic cell as in claim 9 , wherein the third metal layer has a thickness of 20-200 nm.

13. A photovoltaic cell with a back contact made using a method for forming a back contact for a photovoltaic cell that includes at least one cadmium telluride (CdTe) layer, the method comprising:

applying a continuous film of a chemically active material on a surface of the CdTe layer;

activating the chemically active material such that the surface of the CdTe layer is enriched with tellurium (Te);

removing the continuous film of the activated material from the photovoltaic cell; and

depositing a metal contact layer on the Te enriched surface of the CdTe layer;

wherein the CdTe layer has a tellurium to cadmium ratio that is highest at the surface and tapers off while moving deeper inside the semiconductor layer such that the tellurium to cadmium ratio is 1 at a certain depth within the semiconductor layer.

14. The photovoltaic cell of claim 13 , wherein a surface of the CdTe layer has a tellurium (Te)/cadmium (Cd) ratio greater than about two.

15. The photovoltaic cell of claim 13 , wherein said CdTe layer further comprises a plurality of grain boundaries, wherein the CdTe layer is not Te enriched along the grain-boundaries.

16. The photovoltaic cell as in claim 1 , wherein said semiconductor layer further comprises a plurality of grain boundaries, and the semiconductor layer is not Te enriched along the grain-boundaries.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Feb 13, 2026
From: JPMORGAN CHASE BANK, N.A.
To: FIRST SOLAR, INC.
Reel/Frame 074858/0364 →
SECURITY INTEREST Recorded Jul 10, 2023
From: FIRST SOLAR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 064237/0462 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 15, 2021
From: JPMORGAN CHASE BANK, N.A.
To: FIRST SOLAR, INC.
Reel/Frame 058132/0566 →
PATENT SECURITY AGREEMENT Recorded Jul 12, 2017
From: FIRST SOLAR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 043177/0581 →