IP Library Granted Patent US 9,439,626
Granted Patent B2
US 9,439,626 · App. 14/015,043 · Granted Sep 13, 2016

Attachment for ultrasonic probe, ultrasonic probe, electronic device, and ultrasonic diagnostic apparatus

Inventor: Daisuke Nakanishi (Nagano, JP)
Assignee: Seiko Epson Corporation
A61B8/4444A61B8/4483A61B8/587B06B3/00A61B8/4405A61B8/4411A61B8/4427B06B1/0629
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Quick Facts
Patent No.
US 9,439,626
App. No.
14/015,043
Granted
Sep 13, 2016
Kind
B2
Abstract

An attachment for an ultrasonic probe is adapted to be mounted onto an ultrasonic probe body of the ultrasonic probe. The attachment for an ultrasonic probe includes a cover member and a protective member. The cover member is configured and arranged to cover an ultrasonic wave emission surface of a head section of the ultrasonic probe body when the attachment is mounted onto the ultrasonic probe body. The protective member is provided to a surface of the cover member facing the ultrasonic wave emission surface, and configured and arranged to be in contact with the ultrasonic wave emission surface when the attachment is mounted onto the ultrasonic probe body.

Claims (44)

1. An attachment for an ultrasonic probe adapted to be mounted onto an ultrasonic probe body of the ultrasonic probe, the attachment for an ultrasonic probe comprising:

a cover member configured to cover an ultrasonic wave emission surface of a head section of the ultrasonic probe body when the attachment is mounted onto the ultrasonic probe body;

a protective member disposed on an inner surface of the cover member facing the ultrasonic wave emission surface and configured to be in contact with the ultrasonic wave emission surface when the attachment is mounted onto the ultrasonic probe body; and

a reflector that is arranged in the protective member such that the reflector is provided between the cover member and the ultrasonic wave emission source when the attachment is mounted onto the ultrasonic probe body, the reflector having an acoustic impedance greater than an acoustic impedance of the protective member,

the inner surface of the cover member and the reflector being configured to reflect ultrasonic waves emitted from the ultrasonic wave emission surface to the ultrasonic wave emission surface such that the ultrasonic probe carries out an adjustment process to the ultrasonic probe body by using the ultrasonic waves that the inner surface of the cover member and the reflector have been reflected.

2. The attachment for the ultrasonic probe according to claim 1 , wherein

the protective member is formed of a shape and material configured to be in intimate contact with the ultrasonic wave emission surface when the attachment is mounted onto the ultrasonic probe body.

3. The attachment for the ultrasonic probe according to claim 2 , wherein

the protective member has a surface that is configured to face the ultrasonic wave emission surface and has a convex shape before the attachment is mounted onto the ultrasonic probe body.

4. The attachment for the ultrasonic probe according to claim 2 , wherein

the protective member has a surface that is configured to face the ultrasonic wave emission surface and has an inclined shape before the attachment is mounted onto the ultrasonic probe body.

5. The attachment for the ultrasonic probe according to claim 1 , wherein

the protective member is formed of a gel material.

6. An ultrasonic probe comprising:

the attachment for the ultrasonic probe according to claim 1 ; and

the ultrasonic probe body.

7. The ultrasonic probe according to claim 6 , further comprising

a fitting section configured to fit the ultrasonic probe body to the cover member in a state where the ultrasonic wave emission surface and the protective member are in intimate contact.

8. The ultrasonic probe according to claim 7 , wherein

the ultrasonic wave emission surface of the ultrasonic probe body and the protective member of the attachment are in intimate contact when the attachment is mounted onto the ultrasonic probe body.

9. An ultrasonic probe comprising:

a head section including an ultrasonic transducer device, the head section having an ultrasonic wave emission surface; and

a processing apparatus configured to carry out transmission process and receipt process for the ultrasonic transducer device, the processing apparatus being further configured to carry out an adjustment process to the ultrasonic transducer device by using ultrasonic waves that have been emitted from the ultrasonic wave emission surface and have been reflected to the ultrasonic wave emission surface by an inner surface of a cover member and a reflector when the head section is mounted onto an attachment, the attachment including the cover member, a protective member, and the reflector which is arranged in the protective member, the reflector having an acoustic impedance greater than an acoustic impedance of the protective member, the protective member being disposed on the inner surface of the cover member and having a surface facing the ultrasonic wave emission surface and in contact with the ultrasonic wave emission surface.

10. The ultrasonic probe according to claim 9 , wherein

the processing apparatus is configured to carry out the adjustment process using as an ultrasonic phantom the protective member as well as the cover member of the attachment when the attachment is mounted onto the ultrasonic probe, the cover member covering the ultrasonic wave emission surface.

11. The ultrasonic probe according to claim 9 , further comprising

a detection unit including at least one of a sensor and a switch, and configured to detect mounting of the attachment onto the ultrasonic probe, wherein

the processing apparatus is configured to carry out the adjustment process on a condition that the mounting is detected by the detection unit.

12. The ultrasonic probe according to claim 11 , wherein

the processing apparatus is configured to carry out a process for instructing that the mounting be done when the mounting is not detected by the detection unit.

13. The ultrasonic probe according to claim 11 , wherein

the processing apparatus is configured to carry out a process for instructing that the mounting be done when the mounting is not detected by the detection unit after a measurement process.

14. An ultrasonic diagnostic apparatus comprising;

the ultrasonic probe according to claim 6 ;

a main controller configured to control the ultrasonic probe body to transmit and receive ultrasonic waves; and

an image processor configured to generate image data for display based on the ultrasonic waves received by the ultrasonic probe body.

15. The ultrasonic diagnostic apparatus according to claim 14 , further comprising

a display unit configured to display image data for display.

16. The attachment for the ultrasonic probe according to claim 1 , wherein

the reflector is wire-shaped or cylinder-shaped.

17. The attachment for the ultrasonic probe according to claim 1 , wherein

the cover member has an acoustic impedance greater than the acoustic impedance of the protective member.

18. The attachment for the ultrasonic probe according to claim 1 , wherein

the acoustic impedance of the reflector and the acoustic impedance of the cover member are closer to an acoustic impedance of a bone than the acoustic impedance of the protective member.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2013
From: NAKANISHI, DAISUKE
To: SEIKO EPSON CORPORATION
Reel/Frame 031584/0032 →
Priority Claims (1)
JP 2012-192861 · Sep 3, 2012 · national
Continuity (1)
Related Publication 20140066779A1 · Mar 6, 2014