Methods for manufacturing floor panels
View Patent ↗In a method for manufacturing floor panels that have at least a substrate and a top layer provided on the substrate, the top layer including a thermoplastic layer that is translucent or transparent, the method may involve providing the top layer, including the thermoplastic layer, on the substrate. The method may also involve heating at least the thermoplastic layer, and structuring the thermoplastic layer using a mechanical press element.
1. A method for manufacturing a floor panel that includes a synthetic material board and a top layer located on top of the synthetic material board, the top layer including a printed motif and a translucent or transparent wear layer, the method comprising:
manufacturing the synthetic material board with an average density of more than 300 kilograms per cubic meter;
wherein the synthetic material board includes filler materials selected from the group consisting of chalk, wood fiber, and sand; and
wherein at least one separate layer is embedded in the synthetic material board, the separate layer being one of a glass fiber cloth and a glass fiber fabric;
providing the top layer, including the printed motif, on the synthetic material board; and
mechanically embossing the top layer;
wherein manufacturing the synthetic material board and providing the top layer are performed continuously on the same production line.
2. The method of claim 1 , wherein manufacturing the synthetic material board comprises extruding the synthetic material board.
3. The method of claim 1 , wherein providing the top layer comprises placing extruded polyvinyl chloride via heated rollers as a layer-shaped covering on a carrier material.
4. The method of claim 3 , wherein the carrier material comprises glass fiber.
5. The method of claim 3 , wherein the carrier material comprises the synthetic material board.
6. The method of claim 3 , wherein the polyvinyl chloride comprises plasticizers.
7. The method of claim 1 , wherein providing the top layer comprises adhering one or more vinyl containing synthetic material films to the synthetic material board.
8. The method of claim 1 , wherein a board is formed comprising the synthetic material board and the top layer; and
wherein the method further comprises dividing the board into a plurality of floor panels.
9. The method of claim 1 , wherein the floor panel is rigid and cannot be wound up.
10. The method of claim 1 , further comprising providing mechanical coupling means to the floor panel, the mechanical coupling means allowing the floor panel to be coupled at edges to one or more similar panels.