IP Library Granted Patent US 9,251,905
Granted Patent B2
US 9,251,905 · App. 14/016,005 · Granted Feb 2, 2016

Semiconductor integrated circuit including a voltage boosting or lowering circuit

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Quick Facts
Patent No.
US 9,251,905
App. No.
14/016,005
Granted
Feb 2, 2016
Kind
B2
Abstract

A semiconductor integrated circuit includes a reference voltage generation circuit configured to generate a reference voltage, and a voltage changing circuit configured to generate a second voltage from a first voltage based on a difference between the second voltage and the reference voltage and apply the second voltage to a load capacitance. The reference voltage generation circuit includes a variable current source and a capacitor which are connected in series and is configured to change the reference voltage linearly.

Claims (31)

1. A semiconductor integrated circuit comprising:

a reference voltage generation circuit configured to generate a reference voltage;

a first differential amplifier circuit configured to compare a monitored voltage generated from a voltage that is applied to a load capacitance, with the reference voltage and output a first difference signal;

a second differential amplifier circuit configured to compare the monitored voltage with the reference voltage and output a second difference signal;

a voltage boosting circuit configured to generate a boosted voltage that is applied to the load capacitance from a first power supply voltage based on the first difference signal; and

a voltage lowering circuit configured to generate a lowered voltage that is applied to the load capacitance from a second power supply voltage based on the second difference signal, wherein

the reference voltage generation circuit includes a variable current source and a capacitor which are connected in series, and is configured to change the reference voltage linearly.

2. The semiconductor integrated circuit according to claim 1 , wherein the reference voltage generation circuit is controlled to change the reference voltage linearly during a period from a point of time at which changing of the voltage applied to the load capacitance is started to a point of time at which the changed voltage reaches a predetermined value.

3. The semiconductor integrated circuit according to claim 1 , wherein

the reference voltage generation circuit is controlled to change the reference voltage at a first change rate during a first time period and at a second change rate that is different from the first change rate during a second time period.

4. The semiconductor integrated circuit according to claim 1 , further comprising:

a memory cell array including a plurality of planes of memory cells; and

a selection circuit configured to select at least one of the planes,

wherein the load capacitance changes depending on a number of planes selected by the selection circuit.

5. The semiconductor integrated circuit according to claim 4 , wherein

the reference voltage generation circuit is controlled to change the reference voltage at a change rate that is determined according to the number of planes selected by the selection circuit.

6. A semiconductor integrated circuit comprising:

a reference voltage generation circuit including a variable current source and a capacitor which are connected in series;

a first differential amplifier circuit having a first input electrically connected to an output of the reference voltage generation circuit to receive a reference voltage generated by the reference voltage generation circuit, a second input to which a monitored voltage generated from an output voltage is supplied, wherein the first differential amplifier circuit generates a first difference signal based on a difference between the reference voltage and the monitored voltage;

a second differential amplifier circuit having a first input electrically connected to the output of the reference voltage generation circuit to receive the reference voltage generated by the reference voltage generation circuit, a second input to which the monitored voltage is supplied, wherein the second differential amplifier circuit generates a second difference signal based on a difference between the reference voltage and the monitored voltage;

a voltage boosting circuit that boosts the output voltage based on a first power supply voltage and on the first difference signal; and

a voltage lowering circuit that lowers the output voltage based a second power supply voltage and on the second difference signal.

7. The semiconductor integrated circuit according to claim 6 , wherein the reference voltage generation circuit is controlled to change the reference voltage linearly during a period from a point of time at which changing of the output voltage is started to a point of time at which the changed output voltage reaches a predetermined value.

8. The semiconductor integrated circuit according to claim 6 , wherein

the reference voltage generation circuit is controlled to change the reference voltage at a first change rate during a first time period and at a second change rate that is different from the first change rate during a second time period.

9. The semiconductor integrated circuit according to claim 6 , further comprising:

a memory cell array including a plurality of planes of memory cells; and

a selection circuit configured to select at least one of the planes,

wherein the output voltage is changed depending on a number of planes selected by the selection circuit.

10. The semiconductor integrated circuit according to claim 9 , wherein

the reference voltage generation circuit is controlled to change the reference voltage at a change rate that is determined according to the number of planes selected by the selection circuit.

Assignments (5)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043194/0647 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2013
From: UEMURA, MASAFUMI; KOYANAGI, MASARU; YOSHIHARA, MASAHIRO
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 031672/0599 →