Printed circuit board

1. A printed circuit board, comprising:

a flat insulative board;

a first circuit pattern provided on a front surface of the insulative board; and

a second circuit pattern provided on a back surface of the insulative board, wherein the printed circuit board is designed to meet following requirements:

a front-back copper foil residual rate difference (a−b) falls within a range of −10% to −1% and 1% to 10%, where the insulative board is divided into a plurality of divisions in a top view, in which a front surface copper foil residual rate and a back surface copper foil residual rate of each division are a% and b%, respectively;

a difference ((a−b)−(c−d)) between front-back copper foil residual rate differences of adjacent divisions falls within a range of −10% to −1% and 1% to 10%, where the front surface copper foil residual rate and the back surface copper foil residual rate of a division adjacent to the each division are c % and d %, respectively; and

there are not three or more consecutive divisions for which the difference ((a−b)−(c−d)) between the front-back copper foil residual rate differences goes beyond a range of −5% to −1% and 1% to 5%.

2. The printed circuit board according to claim 1 , wherein

a value (a−c) falls within a range of −20% to 20% and a value (b−d) falls within a range of −20% to 20%.

3. The printed circuit board according to claim 2 , wherein

a difference ((a−b)−(c−d)) between the front-back copper foil residual rate differences of a first division under a surface mounted component which is soldered in more than one division and a second division adjacent to the first division falls within a range of −5% to 5%.

4. The printed circuit board according to claim 1 , wherein

a solid copper foil is filled in a place with a lower copper foil residual rate than a predetermined rate to adjust the copper foil residual rate in each division.

5. The printed circuit board according to claim 4 , wherein

a number of holes are opened in the solid copper foil to reduce a stress of the solid copper foil.

6. The printed circuit board according to claim 5 , wherein a size of the holes is any of 1 mm to 3 mm in diameter in a 5 mm*5 mm square.

7. A printed circuit board, comprising:

a flat insulative board;

a first circuit pattern provided on a front surface of the insulative board; and

a second circuit pattern provided on a back surface of the insulative board, wherein the printed circuit board is designed to meet following requirements:

a front-back copper foil residual rate difference (a−b) falls within a range of −10% to −1% and 1% to 10%, where the insulative board is divided into a plurality of divisions in a top view, in which a front surface copper foil residual rate and a back surface copper foil residual rate of each division are a % and b %, respectively;

a difference ((a−b)−(c−d)) between front-back copper foil residual rate differences of adjacent divisions falls within a range of −10% to −1% and 1% to 10%, where the front surface copper foil residual rate and the back surface copper foil residual rate of a division adjacent to the each division are c % and d %, respectively; and

it is permitted there are three or more consecutive divisions for which the difference ((a−b)−(c−d)) between the front-back copper foil residual rate differences of adjacent divisions goes beyond the range of −5% to −1% and 1% to 5% in a vertical direction or in a horizontal direction on a plane of the insulative board in the three or more consecutive divisions at one end of the insulative board, and

there are not three or more consecutive divisions for which the difference ((a−b)−(c−d)) between the front-back copper foil residual rate differences goes beyond a range of −5% to −1% and 1% to 5% in the three or more consecutive divisions other than the end of the insulative board.