RELEASE FILM AND PROCESS FOR PRODUCING LIGHT EMITTING DIODE
Provided is a release film for producing a light emitting diode having desired concaves and convexes accurately transferred directly to the surface of a resin-sealed portion, at a low cost and in high yield, and a process for producing a light emitting diode. A release film 10 having a plurality of convex portions (convex stripes 12 ) and/or concave portions (grooves 14 ) formed on the surface is used as a release film to be placed in a cavity of a mold for forming a resin-sealed portion to seal a light emitting element of a light emitting diode.
1 - 7 . (canceled)
8 . A process for sealing a light emitting element, which is a process for sealing a light emitting element of a light emitting diode with a transparent resin by means of a mold, which comprises:
placing a release film having a plurality of convex portions and/or concave portions formed on at least one surface of said release film in a cavity of a mold so as to cover the inner surface of the cavity of the mold and so that the surface having the convex portions and/or concave portions formed thereon faces a space in the cavity, then
placing the light emitting element in the cavity, and then
filling the cavity with a transparent resin to seal the light emitting element with the transparent resin.
9 . The process for sealing a light emitting element according to claim 8 , wherein the release film is made of a fluororesin.
10 . A process for producing a light emitting diode which comprises sealing a light emitting element with a transparent resin by means of a mold to form a resin-sealed portion, wherein a release film is preliminarily placed in a cavity of the mold, before sealing the light emitting element, and wherein a plurality of convex portions and/or concave portions are formed on at least one surface of the release film.
11 . A process for producing a light emitting diode, which comprises:
placing a release film having a plurality of convex portions and/or concave portions formed on its surface so as to cover the inner surface of a cavity of a mold and so that the convex portions and/or concave portions formed on the surface face a space in the cavity,
placing a substrate having a light emitting element connected thereto in the mold so that the light emitting element is positioned at a prescribed position in the cavity of the mold,
filling the space in the cavity with a resin to form a resin-sealed portion,
taking out the light emitting diode from the mold in such a state that the release film is attached to the resin-sealed portion, and
peeling the release film from the resin-sealed portion.
12 . The process for sealing a light emitting element according to claim 9 , wherein the fluororesin is an ethylene/tetrafluoroethylene copolymer.
13 . The process for sealing a light emitting element according to claim 8 , wherein the convex portions and/or concave portions have inclined surfaces with an inclination angle of from 20 to 75°.
14 . The process for sealing a light emitting element according to claim 8 , wherein an average interval of adjacent local peaks of the convex portions or an average interval of adjacent local bottoms of the concave portions is from 4 to 200 μm, and an average height of the convex portions or an average depth of the concave portions is from 2 to 100 μm.
15 . The process for sealing a light emitting element according to claim 8 , wherein the convex portions are convex stripes with a triangular cross section, and the concave portions are grooves with a V-form cross section.
16 . The process for sealing a light emitting element according to claim 8 , wherein the convex portions are pyramid projections, and the concave portions are pyramid gaps.
17 . The process for sealing a light emitting element according to claim 8 , wherein the thickness of the release film is at most 150 μm.
18 . The process for producing a light emitting diode according to claim 10 , wherein the convex portions and/or concave portions have inclined surfaces with an inclination angle of from 20 to 75°.
19 . The process for producing a light emitting diode according to claim 10 , wherein an average interval of adjacent local peaks of the convex portions or an average interval of adjacent local bottoms of the concave portions is from 4 to 200 μm, and an average height of the convex portions or an average depth of the concave portions is from 2 to 100 μm.
20 . The process for producing a light emitting diode according to claim 10 , wherein the convex portions are convex stripes with a triangular cross section, and the concave portions are grooves with a V-form cross section.
21 . The process for producing a light emitting diode according to claim 10 , wherein the convex portions are pyramid projections, and the concave portions are pyramid gaps.
22 . The process for producing a light emitting diode according to claim 10 , wherein the thickness of the release film is at most 150 μm.
23 . The process for producing a light emitting diode according to claim 11 , wherein the convex portions and/or concave portions have inclined surfaces with an inclination angle of from 20 to 75°.
24 . The process for producing a light emitting diode according to claim 11 , wherein an average interval of adjacent local peaks of the convex portions or an average interval of adjacent local bottoms of the concave portions is from 4 to 200 μm, and an average height of the convex portions or an average depth of the concave portions is from 2 to 100 μm.
25 . The process for producing a light emitting diode according to claim 11 , wherein the convex portions are convex stripes with a triangular cross section, and the concave portions are grooves with a V-form cross section.
26 . The process for producing a light emitting diode according to claim 11 , wherein the convex portions are pyramid projections, and the concave portions are pyramid gaps.
27 . The process for producing a light emitting diode according to claim 11 , wherein the thickness of the release film is at most 150 μm.