Semiconductor device and manufacturing method of the same
View Patent ↗According to one embodiment, a nonvolatile semiconductor storage device includes a semiconductor substrate, a first insulating film formed on the semiconductor substrate, a charge accumulation film formed on the first insulating film, a second insulating film formed on the charge accumulation film, and a control electrode formed on a second insulating film, and one of the first and the second insulating film includes a layer containing nitrogen, a layer that is formed on the layer containing nitrogen and that includes a first oxygen containing aluminum atoms and oxygen atoms, and a layer that is formed on the layer including the first oxygen and that includes a second oxygen containing silicon atoms and oxygen atoms; and a concentration of the aluminum atoms is from 1E12 atoms/cm 2 to 1E16 atoms/cm 2 .
1. A semiconductor storage element in a memory array, comprising:
a semiconductor base material;
a tunnel insulating layer formed on the base material;
a charge accumulation layer formed on the tunnel insulating layer; wherein
the tunnel insulating layer formed between the charge accumulation layer and the base material, the tunnel insulating layer comprising a nitride layer adjacent the base material, an oxide film comprising a first conductor compound layer including a first conductor compound overlying the nitride layer and a second conductor compound layer including a second conductor compound overlying the first conductor compound layer, wherein the second conductor compound comprises an oxygen concentration that is different from an oxygen concentration of the first conductor compound.
2. The semiconductor storage element of claim 1 , wherein the first conductor compound layer is a metal oxide.
3. The semiconductor storage element of claim 2 , wherein the metal oxide comprises an aluminum oxide layer.
4. The semiconductor storage element of claim 3 , further including an insulating layer formed over the charge accumulation layer, and a control gate film formed over the insulation layer.
5. The semiconductor storage element of claim 3 , wherein a concentration of aluminum atoms in the aluminum oxide layer is 1E12 atoms/cm 2 to 1E16 atoms/cm 2 .
6. The semiconductor storage element of claim 1 , wherein the nitride layer is a nitrided oxide layer.
7. A semiconductor storage element for a memory array, comprising:
a semiconductor substrate;
a charge accumulation layer formed on the semiconductor substrate; and
a tunnel insulating layer formed between the charge accumulation layer and the semiconductor substrate, wherein the tunnel insulating layer comprises:
a nitride layer adjacent the semiconductor substrate; and
an oxide film comprising a first conductor layer including a first conductor compound overlying the nitride layer and a second conductor layer including a second conductor compound overlying the first conductor layer, wherein:
the second conductor compound comprises an oxygen concentration that is different from an oxygen concentration of the first conductor compound, and
the second conductor compound comprises atomic specie that are different from atomic specie of the first conductor compound.
8. The semiconductor storage element of claim 7 , wherein the first conductor layer comprises a metal oxide.
9. The semiconductor storage element of claim 8 , wherein the metal oxide comprises an aluminum oxide layer.
10. The semiconductor storage element of claim 9 , further including an insulating layer formed over the charge accumulation layer.
11. The semiconductor storage element of claim 10 , further including a control gate film formed over the insulation layer.
12. The semiconductor storage element of claim 9 , wherein a concentration of aluminum atoms in the aluminum oxide layer is 1E12 atoms/cm 2 to 1E16 atoms/cm 2 .