Granted Patent B2

US 9,105,479 · App. 14/018,484 · Granted Aug 11, 2015

Abstract

Claims (24)

1. An integrated circuit comprising:

a semiconductor substrate including at least one environmental sensor;

a cap layer located on a major surface of the substrate, and

at least one elongate channel for allowing access of said sensor to an environment surrounding the integrated circuit;

wherein the cap layer comprises:

portions that are substantially transparent to allow light to reach an ambient light sensor located in the substrate; and

portions that are substantially opaque to prevent light reaching a temperature sensor located in the substrate.

2. The integrated circuit of claim 1 , wherein at least one said elongate channel passes through the cap layer.

3. The integrated circuit of claim 1 , wherein at least one said elongate channel passes through the semiconductor substrate.

4. The integrated circuit of claim 1 , wherein at least one said elongate channel extends along an interface between the semiconductor substrate and the cap layer.

5. The integrated circuit of claim 1 , wherein the cap layer includes at least one cavity that adjoins an area of the major surface in which at least one environmental sensor is located.

6. The integrated circuit of claim 5 , wherein the cap layer includes a plurality of said cavities, each cavity adjoining a respective area of the major surface in which at least one environmental sensor is located.

7. The integrated circuit of claim 5 , wherein one or more of the cavities(s) is connected to the environment surrounding the integrated circuit by one or more of said elongate channels.

8. The integrated circuit of claim 1 comprising:

a pressure sensor including a deflectable membrane; and

at least one further kind of sensor.

9. The integrated circuit of claim 1 , wherein the cap layer comprises a glass.

10. The integrated circuit of claim 1 , wherein the cap layer comprises a second semiconductor substrate.

11. The integrated circuit of claim 1 , wherein at least some of said elongate channels include one or more corners for inhibiting the incursion of dust.

12. The integrated circuit of claim 1 , wherein the semiconductor substrate including the at least one environmental sensor further comprises:

a plurality of CMOS components forming read-out circuitry for the at least one environmental sensor;

a metallization stack for interconnecting the CMOS components and the at least one environmental sensor, and

a passivation stack on the metallization stack,

wherein the at least one environmental sensor is located in or above the metallization stack.

Assignments (13)