Electronic apparatus
View Patent ↗An electronic apparatus includes a multilayered structure in which a plurality of semiconductor chips provided with semiconductor devices are stacked, penetrating electrodes penetrating the semiconductor chips and electrically connecting the semiconductor devices of the plurality of semiconductor chips, an MEMS chip mounted on the multilayered structure and provided with an MEMS device, wherein pads connecting to the penetrating electrodes are provided on the MEMS chip.
1. An electronic apparatus comprising:
a multilayered structure in which a plurality of semiconductor chips provided with semiconductor devices are stacked;
a plurality of penetrating electrodes penetrating the semiconductor chips and electrically connecting the semiconductor devices of the plurality of semiconductor chips, each of the semiconductor chips including one of the plurality of penetrating electrodes such that a first penetrating electrode in a first semiconductor chip is directly electrically connected to a second penetrating electrode in a second semiconductor chip;
an MEMS chip mounted on the multilayered structure and provided with an MEMS device,
wherein a pad connecting to the plurality of penetrating electrodes is provided on the MEMS chip, and
wherein the plurality of penetrating electrodes connect to a first side of the pad and the MEMS chip is provided on a second side of the pad, opposite the first side, such that the plurality of penetrating electrodes do not extend through the MEMS chip.
2. The electronic apparatus according to claim 1 , wherein a recess part is provided on a surface of the multilayered structure facing the MEMS chip.
3. The electronic apparatus according to claim 1 , wherein the semiconductor device of the semiconductor chip facing the MEMS chip is provided on a surface at the MEMS chip side.
4. The electronic apparatus according to claim 1 , further comprising a thermal conduction part penetrating the semiconductor chips and having higher heat conductivity than that of the semiconductor chips,
wherein the thermal conduction part is electrically separated from the semiconductor devices.
5. The electronic apparatus according to claim 1 , wherein each of the plurality of penetrating electrodes is formed in a center part of each of the semiconductor chips as seen from a stacking direction of the semiconductor chips.
6. The electronic apparatus according to claim 1 , wherein, a capacitor for supplying a power supply voltage to the semiconductor device is provided on the MEMS chip.
7. The electronic apparatus according to claim 1 , wherein a heat dissipation part is provided on a surface of the MEMS chip opposite to the multilayered structure.
8. The electronic apparatus according to claim 1 , wherein the semiconductor devices are stacked directly contacting each other.