IP Library Granted Patent US 9,177,985
Granted Patent B2
US 9,177,985 · App. 14/021,672 · Granted Nov 3, 2015

Array of nanowires in a single cavity with anti-reflective coating on substrate

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Quick Facts
Patent No.
US 9,177,985
App. No.
14/021,672
Granted
Nov 3, 2015
Kind
B2
Abstract

An embodiment relates to image sensor comprising one or more nanowires on a substrate of a cavity, the nanowire being configured to transmit a first portion of an electromagnetic radiation beam incident on the sensor, and the substrate that absorbs a second portion of the electromagnetic radiation beam incident on the sensor, wherein the first portion is substantially different from the second portion. The substrate could have a anti-reflective material. The ratio of a diameter of the cavity to a diameter of the nanowire could be at less than about 10.

Claims (42)

1. An image sensor comprising one or more upstanding nanowires on a substrate, the nanowires being configured to transmit a first portion of an electromagnetic radiation beam incident on the sensor but not to transmit a second portion of the electromagnetic radiation beam incident on the sensor, and the substrate comprising an anti-reflective material that absorbs the second portion of the electromagnetic radiation beam incident on the sensor, wherein the first portion has frequencies higher than a cutoff frequency and the second portion has frequencies lower than the cutoff frequency, wherein the anti-reflective material absorbs at least 68 percent of optical light incident on the anti-reflective material, and wherein the anti-reflective material does not disrupt electronic surface properties of the substrate to cause surface current leakage or provide sites for recombination of carriers generated by photons;

wherein the first portion comprises infrared radiation.

2. The sensor of claim 1 , wherein the second portion comprises at least a portion of electromagnetic radiation that comes out from the nanowire.

3. The sensor of claim 1 , wherein the anti-reflective material is in an anti-reflective layer on a front side of the substrate that is exposed to the electromagnetic radiation beam incident on the sensor.

4. The sensor of claim 1 , wherein at least one of the one or more upstanding nanowires has a diameter above 100 nm.

5. The sensor of claim 1 , wherein the nanowire is configured to separate wavelengths of the electromagnetic radiation beam incident on the nanowire at a selective wavelength.

6. The sensor of claim 1 , wherein at least one of the one or more upstanding nanowires comprises GaAs.

7. The sensor of claim 1 , wherein the substrate comprises GaAs.

8. The sensor of claim 1 , wherein the sensor comprises a plurality of nanowires and is configured to have a substantially minor change in an optical response of the nanowire with a 10° change in a direction of the electromagnetic radiation beam incident on the sensor.

9. The sensor of claim 1 , wherein the anti-reflective layer comprises a plurality of anti-reflective films configured to absorb electromagnetic radiation of a plurality of wavelengths.

10. The sensor of claim 1 , wherein each of the nanowires is configured to separate wavelengths of the electromagnetic radiation beam incident on the nanowire through at a selective wavelength, the sensor further comprising a pair of photosensitive elements comprising a central photosensitive element and a peripheral photosensitive element, wherein the central photosensitive element is operably coupled to the nanowire and the peripheral photosensitive element is operably coupled to the substrate around the nanowire.

11. The sensor of claim 1 , wherein the nanowire is configured to be an active element to detect wavelengths of electromagnetic radiation transmitted through the nanowire.

12. The sensor of claim 11 , wherein the active element is configured to be a photodiode, a charge storage capacitor, or combinations thereof.

13. A device comprising the sensor of claim 10 , wherein the device is an image sensor.

14. The device of claim 13 , wherein the nanowire comprises a waveguide.

15. The device of claim 14 , further comprising a passivation layer around the waveguide.

16. The device of claim 14 , further comprising a metal layer around the waveguide.

17. The device of claim 13 , wherein the device comprises a filter that cuts off visible light and passes IR light.

18. The device of claim 13 , further comprising a cladding surrounding the nanowires, wherein the nanowire has a nanowire index of refraction (n 1 ), and the cladding has a cladding index of refraction (n 2 ), wherein n 1 >n 2 , n 1 =n 2 , or n 1 <n 2 .

19. The device of claim 13 , wherein the selective wavelength is a function of the diameter of a waveguide.

20. The device of claim 14 , further comprising at least a pair of metal contacts with at least one of the metal contacts being contacted to the waveguide.

21. A device comprising the sensor of claim 11 , wherein the device is an image sensor.

22. The device of claim 21 , wherein a waveguide is configured to convert energy of the electromagnetic radiation transmitted through the waveguide and to generate excitons.

23. The device of claim 21 , wherein a waveguide comprises a PIN junction that is configured to detect excitons generated in the waveguide.

24. The device of claim 21 , further comprising an insulator layer around a waveguide and a metal layer around the insulator layer to form a capacitor that is configured to collect the excitons generated in the waveguide and store charge in the capacitor.

25. The device of claim 23 , wherein the active element is configured to be a capacitor;

wherein the nanowire comprises a waveguide, the device further comprising a metal layer around the waveguide and metal contacts that connect to the metal layer and waveguide to control and detect the charge stored in the capacitor.

26. The device of claim 21 , further comprising a cladding around the nanowires, and wherein the substrate comprises a peripheral photosensitive element, wherein the peripheral photosensitive element is operably coupled to the cladding.

27. The device of claim 21 , wherein the substrate comprises an electronic circuit.

28. The device of claim 21 , further comprising a lens structure or an optical coupler over the nanowire, wherein the lens structure or the optical coupler is operably coupled to the nanowire.

29. The device of claim 21 , further comprising a stack surrounding the nanowire, the stack comprising metallic layers embedded in dielectric layers.

30. The device of claim 29 , wherein a surface of the stack comprises a reflective surface.

31. The sensor of claim 1 , wherein the anti-reflective material is not located on the nanowire or on a back-side of the substrate opposite to a front side of the substrate that is exposed to the electromagnetic radiation beam incident on the sensor.

32. The sensor of claim 10 , wherein a wall surface of the nanowire has a reflective surface.

33. The sensor of claim 11 , wherein a wall surface of the nanowire has reflective surface.

34. The sensor of claim 1 , wherein the anti-reflective material absorbs at least about 90 percent of light incident on the anti-reflective material.

35. The sensor of claim 1 , wherein the anti-reflective material reduces a surface leakage current.

36. The sensor of claim 4 , wherein the plurality of nanowires are located so as to create a regular or semi-regular tessellation wherein a shape is repeated over a plane without any gaps or overlaps.

37. The sensor of claim 36 , wherein the regular tessellation is a triangular tessellation, a square tessellation, a hexagonal tessellation or combinations thereof.

38. The sensor of claim 1 , wherein diameters of the nanowires are larger than λ/2n w , wherein λ are the wavelengths of the first portion and n w is a refractive index of the nanowires.

39. The sensor of claim 1 , wherein the nanowires absorb the first portion.

40. The sensor of claim 1 , wherein the electromagnetic radiation beam incident on the sensor impinges the sensor from an exterior of the sensor.

Assignments (4)
SECURITY INTEREST Recorded Mar 28, 2017
From: ZENA TECHNOLOGIES, INC.
To: PILLSBURY WINTHROP SHAW PITTMAN LLP
Reel/Frame 042107/0543 →
SECURITY INTEREST Recorded Mar 10, 2017
From: ZENA TECHNOLOGIES, INC.
To: HABBAL, FAWWAZ
Reel/Frame 041941/0895 →
SECURITY INTEREST Recorded Mar 7, 2017
From: ZENA TECHNOLOGIES, INC.
To: WU, XIANHONG
Reel/Frame 041901/0038 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2013
From: WOBER, MUNIB
To: ZENA TECHNOLOGIES, INC.
Reel/Frame 031167/0523 →