IP Library Granted Patent US 9,523,651
Granted Patent B2
US 9,523,651 · App. 14/023,332 · Granted Dec 20, 2016

Integrated circuit comprising a gas sensor

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Quick Facts
Patent No.
US 9,523,651
App. No.
14/023,332
Granted
Dec 20, 2016
Kind
B2
Abstract

An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate. The integrated circuit also includes an electrical impedance based gas sensor located on the substrate. The sensor includes first and second electrically conductive sensor electrodes. Each sensor electrode is enclosed in an electrically conductive corrosion protection material. The sensor also includes a gas sensitive material located between the sensor electrodes. The impedance of the gas sensitive material is sensitive to a gas to be sensed.

Claims (66)

1. An integrated circuit comprising:

a semiconductor substrate;

a metallization stack;

a passivation stack;

an electrical impedance based gas sensor located on top of the metallization and passivation stacks, the sensor comprising first and second electrically conductive sensor electrodes,

wherein the sensor electrodes are arranged on the substrate,

wherein each sensor electrode is enclosed in an electrically conductive corrosion protection material, and

wherein the electrically conductive corrosion protection material forms an enclosure of sidewalls and a top of the sensor electrodes; and

a gas sensitive material located between the sensor electrodes, wherein the impedance of the gas sensitive material is sensitive to a gas to be sensed,

wherein each sensor electrode enclosed in the electrically conductive corrosion protection material includes a stack comprising:

a first layer of the electrically conductive corrosion protection material;

an electrically conductive electrode layer on the first layer of the electrically conductive corrosion protection material; and

a second layer of the electrically conductive corrosion protection material on the electrically conductive electrode layer,

wherein the stack is coated with a further layer of the electrically conductive corrosion protection material.

2. The integrated circuit of claim 1 , wherein sidewalls of the stack are covered by sidewall spacers of said electrically conductive corrosion protection material.

3. The integrated circuit of claim 1 , wherein the sensor electrodes are arranged as a plurality of interdigitated fingers.

4. The integrated circuit of claim 1 , wherein the sensor electrodes comprise Al.

5. The integrated circuit of claim 1 , wherein the electrically conductive corrosion protection material comprises TiN.

6. A Radio Frequency Identification (RFID) tag comprising an integrated circuit according to claim 1 .

7. A mobile communications device comprising an integrated circuit according to claim 1 .

8. A heating, ventilation and air conditioning (HVAC) system comprising one or more integrated circuits according to claim 1 .

9. The integrated circuit of claim 1 , wherein the enclosure only protects the sidewalls and the top of the electrodes and does not completely encircle the electrodes.

10. A method of making an integrated circuit, the method comprising:

providing a semiconductor substrate, a metallization stack and a passivation stack;

forming an electrical impedance based gas sensor on top of the substrate metallization and passivation stacks, the sensor comprising first and second electrically conductive sensor electrodes,

wherein the sensor electrodes are arranged on the substrate,

wherein each sensor electrode is enclosed in an electrically conductive corrosion protection material, and

wherein the electrically conductive corrosion protection material forms an enclosure of sidewalls and a top of the sensor electrodes;

depositing a gas sensitive material located between the sensor electrodes, the gas sensitive material having an impedance that is sensitive to a gas to be sensed,

wherein forming the first and second electrically conductive sensor electrodes enclosed in the electrically conductive corrosion protection material comprises:

depositing a stack of layers comprising:

a first layer of the electrically conductive corrosion protection material;

an electrically conductive electrode layer on the first layer of the electrically conductive corrosion protection material; and

a second layer of the electrically conductive corrosion protection material on the electrically conductive electrode layer;

patterning the stack; and

coating the stack with a further layer of the electrically conductive corrosion protection material.

11. The method of claim 10 , further comprising covering sidewalls of the stack with sidewall spacers of said electrically conductive corrosion protection material.

12. The method of claim 10 , wherein the enclosure only protects the sidewalls and the top of the electrodes and does not completely encircle the electrodes.

13. An integrated circuit comprising:

a semiconductor substrate;

an electrical impedance based gas sensor located on a passivation layer on the substrate, the sensor comprising first and second electrically conductive sensor electrodes,

wherein the sensor electrodes are arranged on the substrate, and

wherein each sensor electrode is enclosed in an electrically conductive corrosion protection material, and

wherein the electrically conductive corrosion protection material forms an enclosure of sidewalls of the sensor electrodes and a top of the sensor electrodes; and

a gas sensitive material located between the sensor electrodes, wherein the impedance of the gas sensitive material is sensitive to a gas to be sensed,

wherein each sensor electrode enclosed in the electrically conductive corrosion protection material includes a stack comprising:

a first layer of the electrically conductive corrosion protection material;

an electrically conductive electrode layer on the first layer of the electrically conductive corrosion protection material; and

a second layer of the electrically conductive corrosion protection material on the electrically conductive electrode layer,

wherein the stack is coated with a further layer of the electrically conductive corrosion protection material, and

wherein sidewalls of the stack are covered by sidewall spacers of the electrically conductive corrosion protection material, the sidewall spacers being formed by covering the sidewalls of the stack with the electrically conductive corrosion protection material.

14. A method of making an integrated circuit, the method comprising:

providing a semiconductor substrate;

forming an electrical impedance based gas sensor on a passivation layer the substrate, the sensor comprising first and second electrically conductive sensor electrodes,

wherein the sensor electrodes are arranged on the substrate,

wherein each sensor electrode is enclosed in an electrically conductive corrosion protection material, and

wherein the electrically conductive corrosion protection material forms an enclosure of sidewalls of the sensor electrodes and a top of the sensor electrodes; and

depositing a gas sensitive material located between the sensor electrodes, the gas sensitive material having an impedance that is sensitive to a gas to be sensed,

wherein forming the first and second electrically conductive sensor electrodes enclosed in the electrically conductive corrosion protection material comprises:

depositing a stack of layers comprising:

a first layer of the electrically conductive corrosion protection material;

an electrically conductive electrode layer on the first layer of the electrically conductive corrosion protection material; and

a second layer of the electrically conductive corrosion protection material on the electrically conductive electrode layer;

pattering the stack;

coating the stack with a further layer of the electrically conductive corrosion protection material; and

covering sidewalls of the stack with sidewall spacers of the electrically conductive corrosion protection material.

Assignments (13)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: AMS AG; AMS INTERNATIONAL AG; AMS SENSORS UK LIMITED; AMS SENSORS GERMANY GMBH
To: SCIOSENSE B.V.
Reel/Frame 052769/0820 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2015
From: NXP B.V.
To: AMS INTERNATIONAL AG
Reel/Frame 036015/0613 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2013
From: HUMBERT, AURELIE; DAAMEN, ROEL
To: NXP B.V.
Reel/Frame 031214/0382 →