Multi-layer micro-wire substrate method
A method of making a multi-layer micro-wire structure includes providing a substrate having a substrate edge and first and second layers formed over the substrate. One or more micro-channels are imprinted in each of the first and second layers and first and second micro-wires located in the imprinted micro-channels, the micro-wires forming at least a portion of an exposed connection pad in each layer. The second layer edge is farther from the substrate edge than the first layer edge for at least a portion of the second layer edge so that the first connection pads are exposed through the second layer.
1. A method of making a multi-layer micro-wire structure, comprising:
providing a substrate having a substrate edge;
forming a first layer over the substrate extending to a first layer edge;
imprinting the first layer using an imprinting stamp having an inverse first micro-channel structure to form one or more first micro-channels in the first layer;
providing a first micro-wire in at least one imprinted first micro-channel, the first micro-wire forming at least a portion of an exposed first connection pad in the first layer;
forming a second layer over the first layer extending to a second layer edge;
imprinting the second layer using an imprinting stamp having an inverse second micro-channel structure to form one or more second micro-channels in the second layer;
providing a second micro-wire in at least one imprinted second micro-channel, the second micro-wire forming at least a portion of an exposed second connection pad in the second layer; and
wherein the second layer edge is farther from the substrate edge than the first layer edge for at least a portion of the second layer edge so that the first connection pad is exposed through the second layer.
2. The method of claim 1 , further including forming the first connection pad and the second connection pad are in a common row.
3. The method of claim 1 , further including forming the first connection pad and the second connection pad along the substrate edge.
4. The method of claim 1 , further including forming the second layer with a crenellated edge.
5. The method of claim 1 , further including forming the second layer with a straight edge.
6. The method of claim 1 , further including forming the first connection pad in a row adjacent to the substrate edge and forming the second connection pad in a row adjacent to the first connection pad, so that the first connection pad are between the substrate edge and the second connection pad.
7. The method of claim 1 , wherein the substrate has a second substrate edge extending in a different direction from the substrate edge, and further including forming the first connection pads in a row adjacent to the substrate edge and forming the second connection pads in a row adjacent to the second substrate edge.
8. The method of claim 1 , further including forming the first connection pad adjacent to each other and forming the second connection pad adjacent to each other.
9. The method of claim 1 , further including forming the first connection pad and the second connection pad alternately in a row.
10. The method of claim 1 , further including forming the first connection pad in alignment with the second connection pad.
11. The method of claim 1 , further including forming the first connection pad offset from the second connection pad.
12. The method of claim 1 , further including forming the first layer edge coincident with the substrate edge.
13. The method of claim 1 , further including forming a portion of the second layer edge coincident with the substrate edge.
14. The method of claim 1 , further including providing a connector including multiple first and second wires, electrically connecting at least one first wire to one of the first connection pad, and electrically connecting at least one second wire to one of the second connection pads.
15. The method of claim 1 , wherein the connector is a ribbon cable.
16. The method of claim 1 , wherein the connector is flexible, compressible, or compliant.
17. The method of claim 1 , wherein the substrate, the first layer, or the second layer is flexible, compliant, or compressible.
18. The method of claim 1 , further including electrically connecting a first wire is to a first connection pad with an electrically conductive material having a first thickness and electrically connecting a second wire to a second connection pad with the electrically conductive material having a second thickness, wherein the first thickness is greater than the second thickness.
19. The method of claim 1 , further including providing a third layer extending to a third layer edge formed over the second layer, imprinting micro-channels in the third layer and forming micro-wires in the micro-channels to form a plurality of exposed third connection pads in the third layer, wherein the third layer edge is farther from the substrate edge than the first or second layer edge for at least a portion of the first or second layer edge to expose the first and second connection pads.
20. The method of claim 19 , wherein the third layer edge is farther from the substrate edge than the first and second layer edge.
21. The method of claim 1 , wherein the one or more second micro-channels are formed in a common imprinting step with the formation of the second-layer edge.
22. The method of claim 1 , further including removing at least a portion of the substrate edge, the first-layer edge, or the second-layer edge.