Multi-layer forms and methods of manufacturing the same
View Patent ↗Multi-layer forms and methods of producing the same are disclosed herein. An example apparatus includes a first substrate first layer having a first side and a second side. The apparatus includes a second substrate first layer having a third side and a fourth side. The second side is coupled to the third side. The first substrate first layer and the second substrate first layer are embossed. The apparatus includes a second substrate second layer having a fifth side and a sixth side, the fourth side coupled to the fifth side. The apparatus includes a second substrate first layer having a seventh side and an eighth side. The seventh side is coupled to the sixth side. The second substrate first layer and the second substrate second layer are not embossed.
1. A method, comprising:
moving a first substrate in a direction, the first substrate comprising a first side opposite a second side, the first side having a first portion and a second portion, the second portion having a first sub-portion and a second sub-portion, the second side having a third portion and a fourth portion;
applying adhesive to the first portion of the first side;
mating a second substrate with the first portion of the first side;
applying adhesive to the third portion of the second side;
folding the first substrate about a first fold line to couple the third portion to the fourth portion;
applying adhesive to the first sub-portion of the second portion; and
folding the first substrate and the second substrate about a second fold line to couple a face of the first sub-portion and a face of the second sub-portion and to position the first substrate between the second substrate.
2. The method of claim 1 , further comprising, prior to applying adhesive to the first portion, imaging the first portion.
3. The method of claim 1 , further comprising, prior to folding the first substrate about the first fold line, embossing the first substrate and the second substrate to enable the first substrate and the second substrate to include indicia.
4. The method of claim 3 , wherein the second substrate comprises a fifth portion and a sixth portion, the first substrate being positioned between the fifth portion and the sixth portion, the fifth portion comprising the embossing and the sixth portion being non-embossed.
5. The method of claim 3 , further comprising ink tipping the embossing.
6. The method of claim 1 , wherein the folding the first substrate and the second substrate about the second fold line is to produce a multi-layer form.
7. The method of claim 6 , wherein the multi-layer form comprises at least one of a card, a tag, an ornament, or a card and key tag.
8. The method of claim 6 , further comprising mating the multi-layer form with a third substrate, prior to folding the first substrate about the first fold line, the multi-layer form not being mated to the third substrate.
9. The method of claim 8 , wherein the third substrate comprises a carrier web.
10. The method of claim 6 , further comprising forming one or more lines of weakness in the multi-layer form.
11. The method of claim 10 , wherein the one or more lines of weakness define a removable portion.
12. The method of claim 6 , further comprising die-cutting the first and second substrates to separate the multi-layer form from a surrounding waste matrix, after the multi-layer form is separated from the surrounding waste matrix, a perimeter of the multi-layer form is free of any fold lines.
13. The method of claim 1 , wherein the first substrate comprises paper and the second substrate comprises polystyrene.
14. The method of claim 1 , wherein the method comprises an in-line process.
15. The method of claim 1 , further comprising forming a line of weakness through the first and second substrates to define a card surrounded by a waste matrix.
16. The method of claim 1 , wherein the first substrate comprises plastic.
17. The method of claim 1 , further comprising inlaying the first substrate.