IP Library Granted Patent US 9,318,665
Granted Patent B2
US 9,318,665 · App. 14/025,962 · Granted Apr 19, 2016

Light emitting device including flexible substrate, light emitting element, sealing resin, and adhesion layer

Inventor: Motokazu Yamada (Tokushima, JP)
Assignee: NICHIA CORPORATION
H01L33/44F21S4/006F21V21/0808H01L25/0753H05K1/189H05K3/0061F21Y2101/02F21Y2103/003H01L33/54H01L33/62H01L2224/48091H01L2224/73204H01L2224/73265H05K2201/10106
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Quick Facts
Patent No.
US 9,318,665
App. No.
14/025,962
Granted
Apr 19, 2016
Kind
B2
Abstract

A light emitting device includes a flexible substrate, at least one light emitting element, a sealing resin and an adhesion layer. The flexible substrate includes a flexible base member and a plurality of wiring portions disposed on one surface of the base member. The light emitting element is arranged on a first surface of the flexible substrate and electrically connected to the wiring portions. The sealing resin seals the light emitting element. The adhesion layer is arranged on a second surface of the flexible substrate different from the first surface of the flexible substrate. The adhesion layer has a small thickness portion corresponding at least to a region on the first surface where the at least one light emitting element is arranged. The small thickness portion of the adhesion layer has a thickness smaller than a thickness of regions of the adhesion layer other than the portion.

Claims (21)

1. A light emitting device comprising:

a flexible substrate having a first surface and a second surface different from the first surface, the flexible substrate including a flexible base member and a plurality of wiring portions disposed on a first surface side of the base member, the second surface of the flexible substrate being free of a conductive region;

at least one light emitting element arranged on the first surface of the flexible substrate and electrically connected to the wiring portions;

a sealing resin sealing the light emitting element; and

an adhesion layer arranged on the second surface of the flexible substrate, the adhesion layer having a small thickness portion corresponding at least to a region on the first surface where the at least one light emitting element is arranged, the small thickness portion of the adhesion layer having a thickness smaller than a thickness of regions of the adhesion layer other than the portion, the adhesion layer defining concavity and convexity on a second surface side of the flexible substrate.

2. The light emitting device according to claim 1 , wherein the thickness of the small thickness portion of the adhesion layer is zero.

3. The light emitting device according to claim 1 , further comprising a separation layer disposed in the small thickness portion of the adhesion layer.

4. The light emitting device according to claim 3 , wherein the separation layer has a thickness not greater than a depth of the small thickness portion.

5. The light emitting device according to claim 1 , wherein on the first surface of the flexible substrate, the at least one light emitting element is electrically connected to the wiring portions via wires respectively, and the small thickness portion of the adhesion layer extends in a region corresponding to the region on the first surface where the at least one light emitting element is arranged and a region where the wires are arranged.

6. The light emitting device according to claim 1 , wherein the small thickness portion has an area 1 to 100 times that of the at least one light emitting element.

7. The light emitting device according to claim 1 , further comprising a support member disposed on a side of the second surface of the flexible substrate, the support member being arranged so that the support member does not adhere to the small thickness portion of the adhesion layer.

8. A light emitting device comprising:

a flexible substrate including a flexible base member and a plurality of wiring portions disposed on one surface of the base member;

at least one light emitting element arranged on a first surface of the flexible substrate and electrically connected to the wiring portions;

a sealing resin sealing the light emitting element; and

an adhesion layer arranged on a second surface of the flexible substrate different from the first surface of the flexible substrate, the adhesion layer having a small thickness portion corresponding at least to a region on the first surface where the at least one light emitting element is arranged, the small thickness portion of the adhesion layer having a thickness smaller than a thickness of regions of the adhesion layer other than the portion, the adhesion layer is free of a conductive member, the adhesion layer defines concavity and convexity on a second surface side of the flexible substrate.

9. A light emitting device comprising:

a flexible substrate including a flexible base member and a plurality of wiring portions disposed on one surface of the base member;

at least one light emitting element arranged on a first surface of the flexible substrate and electrically connected to the wiring portions;

a sealing resin sealing the light emitting element; and

an adhesion layer arranged on a second surface of the flexible substrate different from the first surface of the flexible substrate, the adhesion layer having a small thickness portion corresponding at least to a region on the first surface where the at least one light emitting element is arranged, the small thickness portion of the adhesion layer having a thickness smaller than a thickness of regions of the adhesion layer other than the portion, the adhesion layer being made of resin material, the adhesion layer defining concavity and convexity on a second surface side of the flexible substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2013
From: YAMADA, MOTOKAZU
To: NICHIA CORPORATION
Reel/Frame 031199/0221 →
Priority Claims (1)
JP 2012-202952 · Sep 14, 2012 · national
Continuity (1)
Related Publication 20140077236A1 · Mar 20, 2014